Adhesive flip chip bonding in a miniaturzed spectrometer

Outi Rusanen, Kimmo Keränen, Martti Blomberg, Ari Lehto

Research output: Contribution to journalOther journal contributionProfessional

1 Citation (Scopus)


This paper discusses the selection of a suitable isotropically-conductive adhesive for flip chip bonding of a micro-machined component. The adhesive must have adequate electrical conductivity and mechnical bonding strength.
Most commercial adhesives possess these qualities. In addition, small bumps of spherical lshape need to be dispensed evenly and repeatedly. Eight adhesives were studied and a suitable one was found.

The manufacture of the spectrometers proceeded successfully. The interferometer was fixed on top of a silicon detector by a flip chip technique using an isotropically-conductive adhesive.
Two prototype series with a total of 25 spectrometers have been produced and 23 of them passed operational testing.
Original languageEnglish
Pages (from-to)239-243
JournalJournal of Electronics Manufacturing
Issue number4
Publication statusPublished - 1997
MoE publication typeD1 Article in a trade journal

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