Abstract
This paper discusses the selection of a suitable isotropically-conductive adhesive for flip chip bonding of a micro-machined component. The adhesive must have adequate electrical conductivity and mechnical bonding strength.
Most commercial adhesives possess these qualities. In addition, small bumps of spherical lshape need to be dispensed evenly and repeatedly. Eight adhesives were studied and a suitable one was found.
The manufacture of the spectrometers proceeded successfully. The interferometer was fixed on top of a silicon detector by a flip chip technique using an isotropically-conductive adhesive.
Two prototype series with a total of 25 spectrometers have been produced and 23 of them passed operational testing.
Most commercial adhesives possess these qualities. In addition, small bumps of spherical lshape need to be dispensed evenly and repeatedly. Eight adhesives were studied and a suitable one was found.
The manufacture of the spectrometers proceeded successfully. The interferometer was fixed on top of a silicon detector by a flip chip technique using an isotropically-conductive adhesive.
Two prototype series with a total of 25 spectrometers have been produced and 23 of them passed operational testing.
| Original language | English |
|---|---|
| Pages (from-to) | 239-243 |
| Journal | Journal of Electronics Manufacturing |
| Volume | 7 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - 1997 |
| MoE publication type | D1 Article in a trade journal |