Adhesive flip chip bonding in a miniaturzed spectrometer

Outi Rusanen, Kimmo Keränen, Martti Blomberg, Ari Lehto

Research output: Contribution to journalOther journal contributionProfessional

1 Citation (Scopus)

Abstract

This paper discusses the selection of a suitable isotropically-conductive adhesive for flip chip bonding of a micro-machined component. The adhesive must have adequate electrical conductivity and mechnical bonding strength.
Most commercial adhesives possess these qualities. In addition, small bumps of spherical lshape need to be dispensed evenly and repeatedly. Eight adhesives were studied and a suitable one was found.

The manufacture of the spectrometers proceeded successfully. The interferometer was fixed on top of a silicon detector by a flip chip technique using an isotropically-conductive adhesive.
Two prototype series with a total of 25 spectrometers have been produced and 23 of them passed operational testing.
Original languageEnglish
Pages (from-to)239-243
JournalJournal of Electronics Manufacturing
Volume7
Issue number4
DOIs
Publication statusPublished - 1997
MoE publication typeD1 Article in a trade journal

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spectrometers
adhesives
silicon
prototypes
detectors
electrical conductivity
manufacturing
testing

Cite this

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title = "Adhesive flip chip bonding in a miniaturzed spectrometer",
abstract = "This paper discusses the selection of a suitable isotropically-conductive adhesive for flip chip bonding of a micro-machined component. The adhesive must have adequate electrical conductivity and mechnical bonding strength. Most commercial adhesives possess these qualities. In addition, small bumps of spherical lshape need to be dispensed evenly and repeatedly. Eight adhesives were studied and a suitable one was found.The manufacture of the spectrometers proceeded successfully. The interferometer was fixed on top of a silicon detector by a flip chip technique using an isotropically-conductive adhesive. Two prototype series with a total of 25 spectrometers have been produced and 23 of them passed operational testing.",
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Adhesive flip chip bonding in a miniaturzed spectrometer. / Rusanen, Outi; Keränen, Kimmo; Blomberg, Martti; Lehto, Ari.

In: Journal of Electronics Manufacturing, Vol. 7, No. 4, 1997, p. 239-243.

Research output: Contribution to journalOther journal contributionProfessional

TY - JOUR

T1 - Adhesive flip chip bonding in a miniaturzed spectrometer

AU - Rusanen, Outi

AU - Keränen, Kimmo

AU - Blomberg, Martti

AU - Lehto, Ari

PY - 1997

Y1 - 1997

N2 - This paper discusses the selection of a suitable isotropically-conductive adhesive for flip chip bonding of a micro-machined component. The adhesive must have adequate electrical conductivity and mechnical bonding strength. Most commercial adhesives possess these qualities. In addition, small bumps of spherical lshape need to be dispensed evenly and repeatedly. Eight adhesives were studied and a suitable one was found.The manufacture of the spectrometers proceeded successfully. The interferometer was fixed on top of a silicon detector by a flip chip technique using an isotropically-conductive adhesive. Two prototype series with a total of 25 spectrometers have been produced and 23 of them passed operational testing.

AB - This paper discusses the selection of a suitable isotropically-conductive adhesive for flip chip bonding of a micro-machined component. The adhesive must have adequate electrical conductivity and mechnical bonding strength. Most commercial adhesives possess these qualities. In addition, small bumps of spherical lshape need to be dispensed evenly and repeatedly. Eight adhesives were studied and a suitable one was found.The manufacture of the spectrometers proceeded successfully. The interferometer was fixed on top of a silicon detector by a flip chip technique using an isotropically-conductive adhesive. Two prototype series with a total of 25 spectrometers have been produced and 23 of them passed operational testing.

U2 - 10.1142/S0960313197000245

DO - 10.1142/S0960313197000245

M3 - Other journal contribution

VL - 7

SP - 239

EP - 243

JO - Journal of Electronics Manufacturing

JF - Journal of Electronics Manufacturing

SN - 0960-3131

IS - 4

ER -