Adhesive flip-chip interconnections for inlays of contact-less smart cards

Jaakko Lenkkeri, Toni Kaskiala, Mark Allen, Tuomo Jaakola, Markku Lahti

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

    Original languageEnglish
    Title of host publicationARCSIS Micropackaging Days 2008
    Subtitle of host publicationCD
    Publication statusPublished - 2008
    MoE publication typeB3 Non-refereed article in conference proceedings
    EventARCSIS Micropackaging Days - Gardanne, France
    Duration: 4 Dec 20085 Dec 2008

    Conference

    ConferenceARCSIS Micropackaging Days
    Country/TerritoryFrance
    CityGardanne
    Period4/12/085/12/08

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