Adhesive flip-chip interconnections for inlays of contact-less smart cards

Jaakko Lenkkeri, Toni Kaskiala, Mark Allen, Tuomo Jaakola, Markku Lahti

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

    Original languageEnglish
    Title of host publicationARCSIS Micropackaging Days 2008
    Subtitle of host publicationCD
    Publication statusPublished - 2008
    MoE publication typeB3 Non-refereed article in conference proceedings
    EventARCSIS Micropackaging Days - Gardanne, France
    Duration: 4 Dec 20085 Dec 2008

    Conference

    ConferenceARCSIS Micropackaging Days
    CountryFrance
    CityGardanne
    Period4/12/085/12/08

    Cite this

    Lenkkeri, J., Kaskiala, T., Allen, M., Jaakola, T., & Lahti, M. (2008). Adhesive flip-chip interconnections for inlays of contact-less smart cards. In ARCSIS Micropackaging Days 2008: CD