Adhesive flip-chip interconnections for inlays of contact-less smart cards

Jaakko Lenkkeri, Toni Kaskiala, Mark Allen, Tuomo Jaakola, Markku Lahti

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

    Original languageEnglish
    Title of host publicationARCSIS Micropackaging Days 2008
    Subtitle of host publicationCD
    Publication statusPublished - 2008
    MoE publication typeB3 Non-refereed article in conference proceedings
    EventARCSIS Micropackaging Days - Gardanne, France
    Duration: 4 Dec 20085 Dec 2008

    Conference

    ConferenceARCSIS Micropackaging Days
    CountryFrance
    CityGardanne
    Period4/12/085/12/08

    Cite this

    Lenkkeri, J., Kaskiala, T., Allen, M., Jaakola, T., & Lahti, M. (2008). Adhesive flip-chip interconnections for inlays of contact-less smart cards. In ARCSIS Micropackaging Days 2008: CD
    Lenkkeri, Jaakko ; Kaskiala, Toni ; Allen, Mark ; Jaakola, Tuomo ; Lahti, Markku. / Adhesive flip-chip interconnections for inlays of contact-less smart cards. ARCSIS Micropackaging Days 2008: CD. 2008.
    @inproceedings{819284c2d0054798be45d8d3eefdd8fa,
    title = "Adhesive flip-chip interconnections for inlays of contact-less smart cards",
    author = "Jaakko Lenkkeri and Toni Kaskiala and Mark Allen and Tuomo Jaakola and Markku Lahti",
    year = "2008",
    language = "English",
    booktitle = "ARCSIS Micropackaging Days 2008",

    }

    Lenkkeri, J, Kaskiala, T, Allen, M, Jaakola, T & Lahti, M 2008, Adhesive flip-chip interconnections for inlays of contact-less smart cards. in ARCSIS Micropackaging Days 2008: CD. ARCSIS Micropackaging Days, Gardanne, France, 4/12/08.

    Adhesive flip-chip interconnections for inlays of contact-less smart cards. / Lenkkeri, Jaakko; Kaskiala, Toni; Allen, Mark; Jaakola, Tuomo; Lahti, Markku.

    ARCSIS Micropackaging Days 2008: CD. 2008.

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

    TY - GEN

    T1 - Adhesive flip-chip interconnections for inlays of contact-less smart cards

    AU - Lenkkeri, Jaakko

    AU - Kaskiala, Toni

    AU - Allen, Mark

    AU - Jaakola, Tuomo

    AU - Lahti, Markku

    PY - 2008

    Y1 - 2008

    M3 - Conference article in proceedings

    BT - ARCSIS Micropackaging Days 2008

    ER -

    Lenkkeri J, Kaskiala T, Allen M, Jaakola T, Lahti M. Adhesive flip-chip interconnections for inlays of contact-less smart cards. In ARCSIS Micropackaging Days 2008: CD. 2008