Adhesive flip-chip interconnections for inlays of contact-less smart cards

Jaakko Lenkkeri, Toni Kaskiala, Mark Allen, Tuomo Jaakola, Markku Lahti

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

Original languageEnglish
Title of host publicationARCSIS Micropackaging Days 2008
Subtitle of host publicationCD
Publication statusPublished - 2008
MoE publication typeB3 Non-refereed article in conference proceedings
EventARCSIS Micropackaging Days - Gardanne, France
Duration: 4 Dec 20085 Dec 2008

Conference

ConferenceARCSIS Micropackaging Days
CountryFrance
CityGardanne
Period4/12/085/12/08

Cite this

Lenkkeri, J., Kaskiala, T., Allen, M., Jaakola, T., & Lahti, M. (2008). Adhesive flip-chip interconnections for inlays of contact-less smart cards. In ARCSIS Micropackaging Days 2008: CD
Lenkkeri, Jaakko ; Kaskiala, Toni ; Allen, Mark ; Jaakola, Tuomo ; Lahti, Markku. / Adhesive flip-chip interconnections for inlays of contact-less smart cards. ARCSIS Micropackaging Days 2008: CD. 2008.
@inproceedings{819284c2d0054798be45d8d3eefdd8fa,
title = "Adhesive flip-chip interconnections for inlays of contact-less smart cards",
author = "Jaakko Lenkkeri and Toni Kaskiala and Mark Allen and Tuomo Jaakola and Markku Lahti",
year = "2008",
language = "English",
booktitle = "ARCSIS Micropackaging Days 2008",

}

Lenkkeri, J, Kaskiala, T, Allen, M, Jaakola, T & Lahti, M 2008, Adhesive flip-chip interconnections for inlays of contact-less smart cards. in ARCSIS Micropackaging Days 2008: CD. ARCSIS Micropackaging Days, Gardanne, France, 4/12/08.

Adhesive flip-chip interconnections for inlays of contact-less smart cards. / Lenkkeri, Jaakko; Kaskiala, Toni; Allen, Mark; Jaakola, Tuomo; Lahti, Markku.

ARCSIS Micropackaging Days 2008: CD. 2008.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

TY - GEN

T1 - Adhesive flip-chip interconnections for inlays of contact-less smart cards

AU - Lenkkeri, Jaakko

AU - Kaskiala, Toni

AU - Allen, Mark

AU - Jaakola, Tuomo

AU - Lahti, Markku

PY - 2008

Y1 - 2008

M3 - Conference article in proceedings

BT - ARCSIS Micropackaging Days 2008

ER -

Lenkkeri J, Kaskiala T, Allen M, Jaakola T, Lahti M. Adhesive flip-chip interconnections for inlays of contact-less smart cards. In ARCSIS Micropackaging Days 2008: CD. 2008