Adhesive flip-chip interconnections for inlays of contact-less smart cards

Jaakko Lenkkeri, Toni Kaskiala, Mark Allen, Tuomo Jaakola, Markku Lahti

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

Original language	English
Title of host publication	ARCSIS Micropackaging Days 2008
Subtitle of host publication	CD
Publication status	Published - 2008
MoE publication type	B3 Non-refereed article in conference proceedings
Event	ARCSIS Micropackaging Days - Gardanne, France Duration: 4 Dec 2008 → 5 Dec 2008

Cite this

@inproceedings{819284c2d0054798be45d8d3eefdd8fa,

title = "Adhesive flip-chip interconnections for inlays of contact-less smart cards",

author = "Jaakko Lenkkeri and Toni Kaskiala and Mark Allen and Tuomo Jaakola and Markku Lahti",

year = "2008",

language = "English",

booktitle = "ARCSIS Micropackaging Days 2008",

note = "ARCSIS Micropackaging Days ; Conference date: 04-12-2008 Through 05-12-2008",

}