Adhesives in micromechanical sensor packaging

Dissertation

Outi Rusanen

Research output: ThesisDissertationMonograph

2 Citations (Scopus)

Abstract

This thesis deals with electronics packaging and its contents can be divided into two parts. The first presents knowledge for selection, use and reliability assessment of isotropically conductive adhesives (ICAs) in die and flip chip bonding. The thesis also proposes a lifetime model of ICA flip chip bonds in thermal cycling. The lifetime of ICA bonds appears to be influenced less by non-recoverable strain than the lifetime of solder bonds. Thus ICAs may outlive solder in applications of cyclic operation, such as under-hood automotive electronics. In the second part this knowledge is utilised in micro electro mechanical system (MEMS) sensor packaging. The applications include a microphone, a differential pressure sensor and a miniaturised IR spectrometer. The effect of packaging on the microphone and the pressure sensor performance has also been evaluated by measurements. The results showed that the effect of packaging was negligible and that these devices can be used in a wide temperature range, e.g. between -40°C and 60°C.
Original languageEnglish
QualificationDoctor Degree
Awarding Institution
  • University of Oulu
Place of PublicationEspoo
Publisher
Print ISBNs951-38-5558-9
Publication statusPublished - 2000
MoE publication typeG4 Doctoral dissertation (monograph)

Fingerprint

Adhesives
Packaging
Sensors
Pressure sensors
Microphones
Soldering alloys
Automobile electronic equipment
Infrared spectrometers
Electronics packaging
Thermal cycling
Temperature

Keywords

  • electronics packaging
  • isotropically conductive adhesives
  • thermal stress
  • viscoelasticity
  • lifetime estimation
  • MEMS

Cite this

Rusanen, O. (2000). Adhesives in micromechanical sensor packaging: Dissertation. Espoo: VTT Technical Research Centre of Finland.
Rusanen, Outi. / Adhesives in micromechanical sensor packaging : Dissertation. Espoo : VTT Technical Research Centre of Finland, 2000. 129 p.
@phdthesis{d111fae4a9ed4c1bad09a9a99b68cfae,
title = "Adhesives in micromechanical sensor packaging: Dissertation",
abstract = "This thesis deals with electronics packaging and its contents can be divided into two parts. The first presents knowledge for selection, use and reliability assessment of isotropically conductive adhesives (ICAs) in die and flip chip bonding. The thesis also proposes a lifetime model of ICA flip chip bonds in thermal cycling. The lifetime of ICA bonds appears to be influenced less by non-recoverable strain than the lifetime of solder bonds. Thus ICAs may outlive solder in applications of cyclic operation, such as under-hood automotive electronics. In the second part this knowledge is utilised in micro electro mechanical system (MEMS) sensor packaging. The applications include a microphone, a differential pressure sensor and a miniaturised IR spectrometer. The effect of packaging on the microphone and the pressure sensor performance has also been evaluated by measurements. The results showed that the effect of packaging was negligible and that these devices can be used in a wide temperature range, e.g. between -40°C and 60°C.",
keywords = "electronics packaging, isotropically conductive adhesives, thermal stress, viscoelasticity, lifetime estimation, MEMS",
author = "Outi Rusanen",
note = "Project code: E5SU00153",
year = "2000",
language = "English",
isbn = "951-38-5558-9",
series = "VTT Publications",
publisher = "VTT Technical Research Centre of Finland",
number = "407",
address = "Finland",
school = "University of Oulu",

}

Rusanen, O 2000, 'Adhesives in micromechanical sensor packaging: Dissertation', Doctor Degree, University of Oulu, Espoo.

Adhesives in micromechanical sensor packaging : Dissertation. / Rusanen, Outi.

Espoo : VTT Technical Research Centre of Finland, 2000. 129 p.

Research output: ThesisDissertationMonograph

TY - THES

T1 - Adhesives in micromechanical sensor packaging

T2 - Dissertation

AU - Rusanen, Outi

N1 - Project code: E5SU00153

PY - 2000

Y1 - 2000

N2 - This thesis deals with electronics packaging and its contents can be divided into two parts. The first presents knowledge for selection, use and reliability assessment of isotropically conductive adhesives (ICAs) in die and flip chip bonding. The thesis also proposes a lifetime model of ICA flip chip bonds in thermal cycling. The lifetime of ICA bonds appears to be influenced less by non-recoverable strain than the lifetime of solder bonds. Thus ICAs may outlive solder in applications of cyclic operation, such as under-hood automotive electronics. In the second part this knowledge is utilised in micro electro mechanical system (MEMS) sensor packaging. The applications include a microphone, a differential pressure sensor and a miniaturised IR spectrometer. The effect of packaging on the microphone and the pressure sensor performance has also been evaluated by measurements. The results showed that the effect of packaging was negligible and that these devices can be used in a wide temperature range, e.g. between -40°C and 60°C.

AB - This thesis deals with electronics packaging and its contents can be divided into two parts. The first presents knowledge for selection, use and reliability assessment of isotropically conductive adhesives (ICAs) in die and flip chip bonding. The thesis also proposes a lifetime model of ICA flip chip bonds in thermal cycling. The lifetime of ICA bonds appears to be influenced less by non-recoverable strain than the lifetime of solder bonds. Thus ICAs may outlive solder in applications of cyclic operation, such as under-hood automotive electronics. In the second part this knowledge is utilised in micro electro mechanical system (MEMS) sensor packaging. The applications include a microphone, a differential pressure sensor and a miniaturised IR spectrometer. The effect of packaging on the microphone and the pressure sensor performance has also been evaluated by measurements. The results showed that the effect of packaging was negligible and that these devices can be used in a wide temperature range, e.g. between -40°C and 60°C.

KW - electronics packaging

KW - isotropically conductive adhesives

KW - thermal stress

KW - viscoelasticity

KW - lifetime estimation

KW - MEMS

M3 - Dissertation

SN - 951-38-5558-9

T3 - VTT Publications

PB - VTT Technical Research Centre of Finland

CY - Espoo

ER -

Rusanen O. Adhesives in micromechanical sensor packaging: Dissertation. Espoo: VTT Technical Research Centre of Finland, 2000. 129 p.