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Adhesives in micromechanical sensor packaging: Dissertation
Outi Rusanen
VTT Technical Research Centre of Finland
Research output
:
Thesis
›
Dissertation
›
Monograph
3
Citations (Scopus)
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Dive into the research topics of 'Adhesives in micromechanical sensor packaging: Dissertation'. Together they form a unique fingerprint.
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Earth and Planetary Sciences
Packaging
100%
Thesis
50%
Microphone
50%
Pressure Sensor
50%
Utilization
50%
Knowledge
50%
Differential Pressure
25%
Microprocessor
25%
Model
25%
Selection
25%
Content
25%
Adhesive
25%
Strain
25%
Solder
25%
Engineering
Conductive Adhesive
100%
Pressure Probe
50%
Applications
50%
Measurement
25%
Temperature Range
25%
Chip Bonding
25%
Models
25%
Spectrometer
25%
Adhesive Bond
25%
Reliability Assessment
25%
Micro-Electro-Mechanical System
25%
Automotive Electronics
25%
Performance
25%
Chemistry
Pressure Sensor
50%
Chemical Bond
50%
Application
50%
Sensor
50%
IR Spectroscopy
25%
Thermal Cycling
25%
Strain
25%
Physics
Solder
50%
Knowledge
50%
Utilization
50%
Adhesive
25%
Model
25%
Performance
25%
Material Science
Devices
25%
Soldering Alloys
25%