Adjusting wetting and adhesion characteristics with ALD and MLD

M. Vähä-Nissi, E. Salo, J. Sievãnen, M. Putkonen, E. Kenttä, A. Harlin

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

Atomic and molecular layer deposition (ALD and MLD, respectively) are based on repeated cycles of gas-solid surface reactions. A monolayer of precursor molecules is chemisorbed onto the surface during a single deposition cycle, enabling control of thin film growth in principle down to sub-monolayer resolution. This level of control has made ALD and MLD interesting for various applications. This presentation shows that low-temperature ALD can also be used to adjust wetting characteristics of polymer webs with non-ideal surfaces. For example, print quality can be optimized by surface modification with just few ALD cycles. We have also developed inorganic-organic hybrid materials providing, for example, improved adhesion between an inorganic oxide surface and extrusion coatings. These open up new application areas for ALD and MLD. Due to e.g. the small amount of deposited materiaL/cycles needed this could also help to alleviate the challenges related to the limited speed of roll-to-roll ALD processes.
Original languageEnglish
Title of host publicationTAPPI 2014 PLACE Conference Proceedings
PublisherTAPPI Press
Pages1062-1091
Volume2
ISBN (Print)978-151080127-1
Publication statusPublished - 2014
MoE publication typeA4 Article in a conference publication
EventTAPPI 2014 PLACE Conference - Ponte Vedra, United States
Duration: 13 May 201415 May 2014

Conference

ConferenceTAPPI 2014 PLACE Conference
CountryUnited States
CityPonte Vedra
Period13/05/1415/05/14

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Vähä-Nissi, M., Salo, E., Sievãnen, J., Putkonen, M., Kenttä, E., & Harlin, A. (2014). Adjusting wetting and adhesion characteristics with ALD and MLD. In TAPPI 2014 PLACE Conference Proceedings (Vol. 2, pp. 1062-1091). TAPPI Press.