Advanced Manufacturing of Flexible Electronic Circuits by Transfer Foil Method

Tuomas Happonen; Mikko Hietala; Arttu Huttunen; Terho Kololuoma; Markus Tuomikoski

doi:10.1109/FLEPS57599.2023.10220368

Advanced Manufacturing of Flexible Electronic Circuits by Transfer Foil Method

Tuomas Happonen^* (Corresponding author), Mikko Hietala, Arttu Huttunen, Terho Kololuoma, Markus Tuomikoski

^*Corresponding author for this work

The Warming Surfaces Company Oy

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Abstract

This study presents an advanced method to manufacture large-area flexible electronic circuits in a continuous roll-to-roll process. Transfer foil method founds on converting processes to cut and laminate thin metal foils to designed patterns onto a target substrate. The processing technique utilizes die-cutting tools, carrier foils and adhesive films to embed functionalities with bulk metal level conductivity directly on various surfaces. Transfer foil method is a chemical-free process and operates at room temperature favoring sustainable manufacturing. Furthermore, integration of rigid electronics on transfer foil patterns is realizable by low temperature soldering as proven in the paper.

Original language	English
Title of host publication	FLEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings
Publisher	IEEE Institute of Electrical and Electronic Engineers
Number of pages	4
ISBN (Electronic)	978-1-6654-5733-0
ISBN (Print)	978-1-6654-9353-6
DOIs	https://doi.org/10.1109/FLEPS57599.2023.10220368
Publication status	Published - 2023
MoE publication type	A4 Article in a conference publication
Event	5th IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2023 - Boston, United States Duration: 9 Jul 2023 → 12 Jul 2023

Publication series

Series	IEEE International Conference on Flexible and Printable Sensors and Systems

Conference

Conference	5th IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2023
Country/Territory	United States
City	Boston
Period	9/07/23 → 12/07/23

Keywords

adhesive film
converting
die-cutting
flexible circuits
metal film
roll-to-roll

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

10.1109/FLEPS57599.2023.10220368

Cite this

Happonen, Tuomas ; Hietala, Mikko ; Huttunen, Arttu et al. / Advanced Manufacturing of Flexible Electronic Circuits by Transfer Foil Method. FLEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings. IEEE Institute of Electrical and Electronic Engineers, 2023. ( IEEE International Conference on Flexible and Printable Sensors and Systems).

@inproceedings{f6ea695616614d0c9678b3b42a753e43,

title = "Advanced Manufacturing of Flexible Electronic Circuits by Transfer Foil Method",

abstract = "This study presents an advanced method to manufacture large-area flexible electronic circuits in a continuous roll-to-roll process. Transfer foil method founds on converting processes to cut and laminate thin metal foils to designed patterns onto a target substrate. The processing technique utilizes die-cutting tools, carrier foils and adhesive films to embed functionalities with bulk metal level conductivity directly on various surfaces. Transfer foil method is a chemical-free process and operates at room temperature favoring sustainable manufacturing. Furthermore, integration of rigid electronics on transfer foil patterns is realizable by low temperature soldering as proven in the paper.",

keywords = "adhesive film, converting, die-cutting, flexible circuits, metal film, roll-to-roll",

author = "Tuomas Happonen and Mikko Hietala and Arttu Huttunen and Terho Kololuoma and Markus Tuomikoski",

note = "Funding Information: This study has received funding from the European Union{\textquoteright}s Horizon Europe research and innovation programme under grant agreement No 101070167. Funding Information: This work utilized the Printed Intelligent Infrastructure (PII-FIRI) supported by Academy of Finland (grant No. 320019) Fig. 3. Die cutting desired pattern (top) and removing excess foil (bottom) in a continuous R2R process. Publisher Copyright: {\textcopyright} 2023 IEEE.; 5th IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2023 ; Conference date: 09-07-2023 Through 12-07-2023",

year = "2023",

doi = "10.1109/FLEPS57599.2023.10220368",

language = "English",

isbn = "978-1-6654-9353-6",

series = " IEEE International Conference on Flexible and Printable Sensors and Systems",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

booktitle = "FLEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings",

address = "United States",

}

Happonen, T, Hietala, M, Huttunen, A, Kololuoma, T & Tuomikoski, M 2023, Advanced Manufacturing of Flexible Electronic Circuits by Transfer Foil Method. in FLEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings. IEEE Institute of Electrical and Electronic Engineers, IEEE International Conference on Flexible and Printable Sensors and Systems, 5th IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2023, Boston, Massachusetts, United States, 9/07/23. https://doi.org/10.1109/FLEPS57599.2023.10220368

Advanced Manufacturing of Flexible Electronic Circuits by Transfer Foil Method. / Happonen, Tuomas (Corresponding author); Hietala, Mikko; Huttunen, Arttu et al.
FLEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings. IEEE Institute of Electrical and Electronic Engineers, 2023. ( IEEE International Conference on Flexible and Printable Sensors and Systems).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Advanced Manufacturing of Flexible Electronic Circuits by Transfer Foil Method

AU - Happonen, Tuomas

AU - Hietala, Mikko

AU - Huttunen, Arttu

AU - Kololuoma, Terho

AU - Tuomikoski, Markus

N1 - Funding Information: This study has received funding from the European Union’s Horizon Europe research and innovation programme under grant agreement No 101070167. Funding Information: This work utilized the Printed Intelligent Infrastructure (PII-FIRI) supported by Academy of Finland (grant No. 320019) Fig. 3. Die cutting desired pattern (top) and removing excess foil (bottom) in a continuous R2R process. Publisher Copyright: © 2023 IEEE.

PY - 2023

Y1 - 2023

N2 - This study presents an advanced method to manufacture large-area flexible electronic circuits in a continuous roll-to-roll process. Transfer foil method founds on converting processes to cut and laminate thin metal foils to designed patterns onto a target substrate. The processing technique utilizes die-cutting tools, carrier foils and adhesive films to embed functionalities with bulk metal level conductivity directly on various surfaces. Transfer foil method is a chemical-free process and operates at room temperature favoring sustainable manufacturing. Furthermore, integration of rigid electronics on transfer foil patterns is realizable by low temperature soldering as proven in the paper.

AB - This study presents an advanced method to manufacture large-area flexible electronic circuits in a continuous roll-to-roll process. Transfer foil method founds on converting processes to cut and laminate thin metal foils to designed patterns onto a target substrate. The processing technique utilizes die-cutting tools, carrier foils and adhesive films to embed functionalities with bulk metal level conductivity directly on various surfaces. Transfer foil method is a chemical-free process and operates at room temperature favoring sustainable manufacturing. Furthermore, integration of rigid electronics on transfer foil patterns is realizable by low temperature soldering as proven in the paper.

KW - adhesive film

KW - converting

KW - die-cutting

KW - flexible circuits

KW - metal film

KW - roll-to-roll

UR - http://www.scopus.com/inward/record.url?scp=85171587702&partnerID=8YFLogxK

U2 - 10.1109/FLEPS57599.2023.10220368

DO - 10.1109/FLEPS57599.2023.10220368

M3 - Conference article in proceedings

AN - SCOPUS:85171587702

SN - 978-1-6654-9353-6

T3 - IEEE International Conference on Flexible and Printable Sensors and Systems

BT - FLEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - 5th IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2023

Y2 - 9 July 2023 through 12 July 2023

ER -

Happonen T, Hietala M, Huttunen A, Kololuoma T, Tuomikoski M. Advanced Manufacturing of Flexible Electronic Circuits by Transfer Foil Method. In FLEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings. IEEE Institute of Electrical and Electronic Engineers. 2023. ( IEEE International Conference on Flexible and Printable Sensors and Systems). doi: 10.1109/FLEPS57599.2023.10220368

Advanced Manufacturing of Flexible Electronic Circuits by Transfer Foil Method

Abstract

Publication series

Conference

Keywords

UN SDGs

Access to Document

Other files and links

Fingerprint

Cite this