TY - JOUR
T1 - Advances in design and manufacture of stretchable electronics
AU - Gillan, Liam
AU - Hiltunen, Jussi
AU - Behfar, Mohammad H.
AU - Rönkä, Kari
PY - 2022
Y1 - 2022
N2 - Flexible and stretchable electronics present opportunities for transition from rigid bulky devices to soft and conformal systems. However, such technology requires mechanical design and integration strategies to enhance robustness and form factor. In addition, scalable and reliable fabrication pathways are needed to facilitate the high volume manufacturing required to satisfy a growing market demand. This report describes recent advances in design, manufacture, and reliability of flexible and stretchable electronics technology. Flexible concept devices for physiological monitoring are introduced, before discussion of high throughput fabrication of stretchable electronics, then hybrid integration of conventional rigid components on stretchable carrier substrates with an emphasis on a need for further developments in device reliability testing procedures. Finally, consideration is given to transition options for more eco-conscious device constituents. These cases progress flexible and stretchable electronics towards robust, fully integrated, unobtrusive devices incorporating sustainable components.
AB - Flexible and stretchable electronics present opportunities for transition from rigid bulky devices to soft and conformal systems. However, such technology requires mechanical design and integration strategies to enhance robustness and form factor. In addition, scalable and reliable fabrication pathways are needed to facilitate the high volume manufacturing required to satisfy a growing market demand. This report describes recent advances in design, manufacture, and reliability of flexible and stretchable electronics technology. Flexible concept devices for physiological monitoring are introduced, before discussion of high throughput fabrication of stretchable electronics, then hybrid integration of conventional rigid components on stretchable carrier substrates with an emphasis on a need for further developments in device reliability testing procedures. Finally, consideration is given to transition options for more eco-conscious device constituents. These cases progress flexible and stretchable electronics towards robust, fully integrated, unobtrusive devices incorporating sustainable components.
UR - http://www.scopus.com/inward/record.url?scp=85129091127&partnerID=8YFLogxK
U2 - 10.35848/1347-4065/ac586f
DO - 10.35848/1347-4065/ac586f
M3 - Article
AN - SCOPUS:85129091127
SN - 0021-4922
VL - 61
JO - Japanese Journal of Applied Physics
JF - Japanese Journal of Applied Physics
IS - SE
M1 - SE0804
ER -