Advances in the CMP process on fixed abrasive pads for the polishing of SOI-substrates with high degree of flatness

Martin Kulawski; Hannu Luoto; Kimmo Henttinen; Ilkka Suni; F. Weimar; J. Mäkinen

Advances in the CMP process on fixed abrasive pads for the polishing of SOI-substrates with high degree of flatness

Martin Kulawski
, Hannu Luoto
, Kimmo Henttinen
, Ilkka Suni
, F. Weimar
, J. Mäkinen

VTT Technical Research Centre of Finland

VTT (former employee or external)

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

4 Citations (Scopus)

Original language	English
Title of host publication	Advances in Chemical-Mechanical Polishing
Editors	Duane S. Boning, Johann W. Bartha, Ara Philipossian, Greg Shinn, Ingrid Vos
Publisher	Cambridge University Press
Pages	191-196
ISBN (Print)	978-1-55899-766-0
Publication status	Published - 2004
MoE publication type	A4 Article in a conference publication

Publication series

Series	Materials Research Society Symposia Proceedings
Volume	816
ISSN	0272-9172

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Cite this

Kulawski, Martin ; Luoto, Hannu ; Henttinen, Kimmo et al. / Advances in the CMP process on fixed abrasive pads for the polishing of SOI-substrates with high degree of flatness. Advances in Chemical-Mechanical Polishing. editor / Duane S. Boning ; Johann W. Bartha ; Ara Philipossian ; Greg Shinn ; Ingrid Vos. Cambridge University Press, 2004. pp. 191-196 (Materials Research Society Symposia Proceedings, Vol. 816).

@inproceedings{088d0651e853441984eb00d09be00215,

title = "Advances in the CMP process on fixed abrasive pads for the polishing of SOI-substrates with high degree of flatness",

author = "Martin Kulawski and Hannu Luoto and Kimmo Henttinen and Ilkka Suni and F. Weimar and J. M{\"a}kinen",

year = "2004",

language = "English",

isbn = "978-1-55899-766-0",

series = "Materials Research Society Symposia Proceedings",

publisher = "Cambridge University Press",

pages = "191--196",

editor = "Boning, \{Duane S.\} and Bartha, \{Johann W.\} and Ara Philipossian and Greg Shinn and Ingrid Vos",

booktitle = "Advances in Chemical-Mechanical Polishing",

address = "United Kingdom",

}

Kulawski, M, Luoto, H, Henttinen, K, Suni, I, Weimar, F & Mäkinen, J 2004, Advances in the CMP process on fixed abrasive pads for the polishing of SOI-substrates with high degree of flatness. in DS Boning, JW Bartha, A Philipossian, G Shinn & I Vos (eds), Advances in Chemical-Mechanical Polishing. Cambridge University Press, Materials Research Society Symposia Proceedings, vol. 816, pp. 191-196.

Advances in the CMP process on fixed abrasive pads for the polishing of SOI-substrates with high degree of flatness. / Kulawski, Martin; Luoto, Hannu; Henttinen, Kimmo et al.
Advances in Chemical-Mechanical Polishing. ed. / Duane S. Boning; Johann W. Bartha; Ara Philipossian; Greg Shinn; Ingrid Vos. Cambridge University Press, 2004. p. 191-196 (Materials Research Society Symposia Proceedings, Vol. 816).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Advances in the CMP process on fixed abrasive pads for the polishing of SOI-substrates with high degree of flatness

AU - Kulawski, Martin

AU - Luoto, Hannu

AU - Henttinen, Kimmo

AU - Suni, Ilkka

AU - Weimar, F.

AU - Mäkinen, J.

PY - 2004

Y1 - 2004

M3 - Conference article in proceedings

SN - 978-1-55899-766-0

T3 - Materials Research Society Symposia Proceedings

SP - 191

EP - 196

BT - Advances in Chemical-Mechanical Polishing

A2 - Boning, Duane S.

A2 - Bartha, Johann W.

A2 - Philipossian, Ara

A2 - Shinn, Greg

A2 - Vos, Ingrid

PB - Cambridge University Press

ER -

Kulawski M, Luoto H, Henttinen K, Suni I, Weimar F, Mäkinen J. Advances in the CMP process on fixed abrasive pads for the polishing of SOI-substrates with high degree of flatness. In Boning DS, Bartha JW, Philipossian A, Shinn G, Vos I, editors, Advances in Chemical-Mechanical Polishing. Cambridge University Press. 2004. p. 191-196. (Materials Research Society Symposia Proceedings, Vol. 816).