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AlN metal-semiconductor field-effect transistors using Si-ion implantation

  • Hironori Okumura*
  • , Sami Suihkonen
  • , Jori Lemettinen
  • , Akira Uedono
  • , Yuhao Zhang
  • , Daniel Piedra
  • , Tomás Palacios
  • *Corresponding author for this work
  • University of Tsukuba
  • MIT Massachusetts Institute of Technology
  • Aalto University

Research output: Contribution to journalArticleScientificpeer-review

Abstract

We report on the electrical characterization of Si-ion implanted AlN layers and the first demonstration of metal-semiconductor field-effect transistors (MESFETs) with an ion-implanted AlN channel. The ion-implanted AlN layers with Si dose of 5 × 1014 cm-2 exhibit n-type characteristics after thermal annealing at 1230°C. The ion-implanted AlN MESFETs provide good drain current saturation and stable pinch-off operation even at 250°C. The off-state breakdown voltage is 2370V for drain-to-gate spacing of 25μm. These results show the great potential of AlN-channel transistors for high-temperature and high-power applications.
Original languageEnglish
Article number04FR11
JournalJapanese Journal of Applied Physics
Volume57
Issue number4
DOIs
Publication statusPublished - 1 Apr 2018
MoE publication typeA1 Journal article-refereed

Funding

This work was supported by JSPS KAKENHI Grant Numbers 16H06424 and 17K14110, and the ONR PECASE program, monitored by Dr. Paul Maki, S. Suihkonen, and J. Lemettinen acknowledge the financial support of the Academy of Finland (Grant 297916) and the Foundation for Aalto University Science and Technology. A part of the research was performed at the OtaNano-Micronova Nano-fabrication Centre of Aalto University.

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