Keyphrases
Low Temperature
100%
Atomic Layer Deposition
100%
Plasma-enhanced Atomic Layer Deposition (PEALD)
100%
Al2O3 Thin Films
100%
Thermal Plasma
100%
Water Vapor Transmission Rate
50%
Impurities
50%
Residual Stress
50%
Growth Properties
50%
Aluminum Oxide
50%
In Situ
50%
Plasma Exposure
50%
Polyethylene Naphthalate
50%
Treatment Process
50%
Elemental Composition
50%
Exposure Time
50%
Thermal Atomic Layer Deposition
50%
Growth Behavior
50%
Al2O3 Film
50%
Moisture Barrier
50%
Mass Density
50%
Tensile Residual Stress
50%
N2O Plasma Treatment
50%
Process Parameters Influence
50%
INIS
layers
100%
applications
100%
plasma
100%
low temperature
100%
thin films
100%
deposition
100%
encapsulation
100%
density
66%
residual stresses
66%
films
66%
moisture
33%
optimization
33%
roughness
33%
carbon
33%
substrates
33%
transmission
33%
barriers
33%
water vapor
33%
growth
33%
pressure range mega pa
33%
hydrogen
33%
impurities
33%
polyethylenes
33%
nitrogen
33%
Engineering
Low-Temperature
100%
Atomic Layer Deposition
100%
Thin Films
100%
Deposition Process
100%
Process Parameter
50%
Exposure Time
50%
Elemental Composition
50%
Plasma Treatment
50%
Tensile Residual Stress
50%
Residual Stress
50%
Moisture Permeation
50%
Growth Behavior
50%
Material Science
Al2O3
100%
Thin Films
100%
Residual Stress
50%
Film
50%
Density
50%
Polyethylene
25%
Water Vapor
25%
Phase Composition
25%