Ambient intelligence and embedded electronics

Paul Collander, Esko Strömmer, Mikko Malmivaara

    Research output: Contribution to conferenceConference articleScientificpeer-review

    Abstract

    During the last decade, we have witnessed increasing interest in the Ambient Intelligence research field and its predecessors, ubiquitous (or pervasive) computing and communication. We have also seen remarkable advancement in the technologies that enable the Ambient Intelligence vision: microelectronics, low power electronics, CMOS RF, MEMS, wireless and wired communications, processor architectures, software technologies and communication systems such as mobile phones, Internet and WWW. Ambient Intelligence has also attracted great attention among industrial companies and been foreseen to be a very promising growing business area in the IT field. This paper describes some visions of AmI, its components, how they are interconnected and how they are connected to existing networks. A lot of European activities are aiming at the implementation of this concept.
    Original languageEnglish
    Publication statusPublished - 2004
    MoE publication typeNot Eligible
    EventInternational Conference on Electronics Packaging, ICEP - Tokyo, Japan
    Duration: 14 Apr 200416 Apr 2004

    Conference

    ConferenceInternational Conference on Electronics Packaging, ICEP
    Abbreviated titleICEP
    CountryJapan
    CityTokyo
    Period14/04/0416/04/04

    Keywords

    • ambient Intelligence
    • ubiquitous Communication
    • disappearing Computer
    • microelectronics Packaging

    Fingerprint Dive into the research topics of 'Ambient intelligence and embedded electronics'. Together they form a unique fingerprint.

  • Cite this

    Collander, P., Strömmer, E., & Malmivaara, M. (2004). Ambient intelligence and embedded electronics. Paper presented at International Conference on Electronics Packaging, ICEP, Tokyo, Japan.