Ambient intelligence and embedded electronics

Paul Collander, Esko Strömmer, Mikko Malmivaara

Research output: Contribution to conferenceConference articleScientificpeer-review

Abstract

During the last decade, we have witnessed increasing interest in the Ambient Intelligence research field and its predecessors, ubiquitous (or pervasive) computing and communication. We have also seen remarkable advancement in the technologies that enable the Ambient Intelligence vision: microelectronics, low power electronics, CMOS RF, MEMS, wireless and wired communications, processor architectures, software technologies and communication systems such as mobile phones, Internet and WWW. Ambient Intelligence has also attracted great attention among industrial companies and been foreseen to be a very promising growing business area in the IT field. This paper describes some visions of AmI, its components, how they are interconnected and how they are connected to existing networks. A lot of European activities are aiming at the implementation of this concept.
Original languageEnglish
Publication statusPublished - 2004
MoE publication typeNot Eligible
EventInternational Conference on Electronics Packaging, ICEP - Tokyo, Japan
Duration: 14 Apr 200416 Apr 2004

Conference

ConferenceInternational Conference on Electronics Packaging, ICEP
Abbreviated titleICEP
CountryJapan
CityTokyo
Period14/04/0416/04/04

Fingerprint

Electronic equipment
Ubiquitous computing
Low power electronics
Communication
Software architecture
Mobile phones
Microelectronics
World Wide Web
MEMS
Industry
Communication systems
Internet
Ambient intelligence

Keywords

  • ambient Intelligence
  • ubiquitous Communication
  • disappearing Computer
  • microelectronics Packaging

Cite this

Collander, P., Strömmer, E., & Malmivaara, M. (2004). Ambient intelligence and embedded electronics. Paper presented at International Conference on Electronics Packaging, ICEP, Tokyo, Japan.
Collander, Paul ; Strömmer, Esko ; Malmivaara, Mikko. / Ambient intelligence and embedded electronics. Paper presented at International Conference on Electronics Packaging, ICEP, Tokyo, Japan.
@conference{fbb8f27ea1824582827a69bbcd4865e9,
title = "Ambient intelligence and embedded electronics",
abstract = "During the last decade, we have witnessed increasing interest in the Ambient Intelligence research field and its predecessors, ubiquitous (or pervasive) computing and communication. We have also seen remarkable advancement in the technologies that enable the Ambient Intelligence vision: microelectronics, low power electronics, CMOS RF, MEMS, wireless and wired communications, processor architectures, software technologies and communication systems such as mobile phones, Internet and WWW. Ambient Intelligence has also attracted great attention among industrial companies and been foreseen to be a very promising growing business area in the IT field. This paper describes some visions of AmI, its components, how they are interconnected and how they are connected to existing networks. A lot of European activities are aiming at the implementation of this concept.",
keywords = "ambient Intelligence, ubiquitous Communication, disappearing Computer, microelectronics Packaging",
author = "Paul Collander and Esko Str{\"o}mmer and Mikko Malmivaara",
year = "2004",
language = "English",
note = "International Conference on Electronics Packaging, ICEP, ICEP ; Conference date: 14-04-2004 Through 16-04-2004",

}

Collander, P, Strömmer, E & Malmivaara, M 2004, 'Ambient intelligence and embedded electronics' Paper presented at International Conference on Electronics Packaging, ICEP, Tokyo, Japan, 14/04/04 - 16/04/04, .

Ambient intelligence and embedded electronics. / Collander, Paul; Strömmer, Esko; Malmivaara, Mikko.

2004. Paper presented at International Conference on Electronics Packaging, ICEP, Tokyo, Japan.

Research output: Contribution to conferenceConference articleScientificpeer-review

TY - CONF

T1 - Ambient intelligence and embedded electronics

AU - Collander, Paul

AU - Strömmer, Esko

AU - Malmivaara, Mikko

PY - 2004

Y1 - 2004

N2 - During the last decade, we have witnessed increasing interest in the Ambient Intelligence research field and its predecessors, ubiquitous (or pervasive) computing and communication. We have also seen remarkable advancement in the technologies that enable the Ambient Intelligence vision: microelectronics, low power electronics, CMOS RF, MEMS, wireless and wired communications, processor architectures, software technologies and communication systems such as mobile phones, Internet and WWW. Ambient Intelligence has also attracted great attention among industrial companies and been foreseen to be a very promising growing business area in the IT field. This paper describes some visions of AmI, its components, how they are interconnected and how they are connected to existing networks. A lot of European activities are aiming at the implementation of this concept.

AB - During the last decade, we have witnessed increasing interest in the Ambient Intelligence research field and its predecessors, ubiquitous (or pervasive) computing and communication. We have also seen remarkable advancement in the technologies that enable the Ambient Intelligence vision: microelectronics, low power electronics, CMOS RF, MEMS, wireless and wired communications, processor architectures, software technologies and communication systems such as mobile phones, Internet and WWW. Ambient Intelligence has also attracted great attention among industrial companies and been foreseen to be a very promising growing business area in the IT field. This paper describes some visions of AmI, its components, how they are interconnected and how they are connected to existing networks. A lot of European activities are aiming at the implementation of this concept.

KW - ambient Intelligence

KW - ubiquitous Communication

KW - disappearing Computer

KW - microelectronics Packaging

M3 - Conference article

ER -

Collander P, Strömmer E, Malmivaara M. Ambient intelligence and embedded electronics. 2004. Paper presented at International Conference on Electronics Packaging, ICEP, Tokyo, Japan.