Abstract
An amplifier module comprises an output waveguide integrated into the amplifier module, a first MMIC amplifier (A1) having a first power output (22), a second MMIC amplifier (A2) having a second power output (24), an output microstrip line (34B) having a capacitive end line (38B), an output microstrip line to output waveguide transition, and a power combiner combining the first and second power outputs (22, 24) to the output microstrip line (34B). The power combiner comprises a first bonding wire (40) coupled between the first power output (22) of the first MMIC amplifier (A1) and the capacitive end line (38B), and a second bonding wire (42) coupled between the second power output (24) of the second MMIC amplifier (A2) and the capacitive end line (38B).
Patent family as of 14.7.2026
FI131875 B, FI20236361 A, WO25125718 A1
Patent family as of 14.7.2026
FI131875 B, FI20236361 A, WO25125718 A1
| Original language | English |
|---|---|
| Patent number | FI 131875 B1 |
| IPC | H01P5/107 |
| Priority date | 11/12/23 |
| Filing date | 11/12/23 |
| Publication status | Published - 21 Jan 2026 |
| MoE publication type | H1 Granted patent |
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