An analysis of conventional and self-aligned four terminal resistor structures for the determination of the contact resistivity from end resistance measurements

Ilkka Suni, M. Finetti, Kaj Grahn

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

A computer model based on the finite element method has been applied to evaluate the effect of the parasitic area between contact and diffusion edges on end resistance measurements in four terminal Kelvin resistor structures. The model is then applied to Al/Ti/n+ Si contacts and a value of contact resistivity of Qc = 1.8×10−7 Ω·cm² is derived. For comparison, the use of a self-aligned structure to avoid parasitic effects is presented and the first experimental results obtained on Al/Ti/n+Si and Al/CoSi2/n+Si contacts are shown and discussed.
Original languageEnglish
Title of host publicationMaterials Issues in Silicon Integrated Circuit Processing
Subtitle of host publicationSymposium F
EditorsM. Wittmer, James Stimmell, M. Strathman
Place of PublicationPittsburgh
PublisherMaterials Research Society
Pages363-368
ISBN (Print)978-0-931837-37-1
DOIs
Publication statusPublished - 1986
MoE publication typeA4 Article in a conference publication

Publication series

SeriesMRS Online Proceedings
Volume71
ISSN0272-9172

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