An Attenuator or a dissipating element

Janne Lehtinen; Mika Prunnila; Nikolai Yurttagul; Alberto Ronzani

An Attenuator or a dissipating element

Janne Lehtinen (Inventor)
, Mika Prunnila (Inventor)
, Nikolai Yurttagul (Inventor)
, Alberto Ronzani (Inventor)

BA6210 Quantum sensors

Research output: Patent › Patent

Abstract

An attenuator arranged to thermalize radio frequency components, or a dissipating element arranged to thermalize lower frequency components than the radio frequency components, comprising: at least a first heat sink and a second heat sink; and at least one tunnel junction coupled to the first heat sink and the second heat sink, wherein the first heat sink and the second heat sink are capacitively grounded and arranged to provide heat dissipation via electron-phonon coupling; and wherein a combined resistance of the at least one tunnel junction and a heat sink coupled to it is below h e 2, and/or a total capacitance of the first heat sink is above e 2 2 k b T and a total capacitance of the second heat sink is above e 2 2 k b T, wherein h is the Planck constant, e is the elementary charge, kb is the Boltzmann constant and T is the minimum temperature, where the attenuator or the dissipating element is arranged to be used.

Patent family as of 17.7.2026
AU2022332648 AA, CA3229164 AA, CN117957766 A, DE602022028480 D1, EP4393061 A1, EP4393061 B1, EP4393061 C0, EP4647977 A2, EP4647977 A3, JP2024530270 T2, US2025132482 AA, US2025155295 AA, WO23025985 A1

Original language	English
Patent number	EP4393061 B1
IPC	G06N10/40
Priority date	23/08/21
Filing date	23/08/22
Publication status	Published - 14 Jan 2026
MoE publication type	H1 Granted patent

Cite this

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abstract = "An attenuator arranged to thermalize radio frequency components, or a dissipating element arranged to thermalize lower frequency components than the radio frequency components, comprising: at least a first heat sink and a second heat sink; and at least one tunnel junction coupled to the first heat sink and the second heat sink, wherein the first heat sink and the second heat sink are capacitively grounded and arranged to provide heat dissipation via electron-phonon coupling; and wherein a combined resistance of the at least one tunnel junction and a heat sink coupled to it is below h e 2, and/or a total capacitance of the first heat sink is above e 2 2 k b T and a total capacitance of the second heat sink is above e 2 2 k b T, wherein h is the Planck constant, e is the elementary charge, kb is the Boltzmann constant and T is the minimum temperature, where the attenuator or the dissipating element is arranged to be used. Patent family as of 17.7.2026 AU2022332648 AA, CA3229164 AA, CN117957766 A, DE602022028480 D1, EP4393061 A1, EP4393061 B1, EP4393061 C0, EP4647977 A2, EP4647977 A3, JP2024530270 T2, US2025132482 AA, US2025155295 AA, WO23025985 A1",

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AU - Yurttagul, Nikolai

AU - Ronzani, Alberto

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N2 - An attenuator arranged to thermalize radio frequency components, or a dissipating element arranged to thermalize lower frequency components than the radio frequency components, comprising: at least a first heat sink and a second heat sink; and at least one tunnel junction coupled to the first heat sink and the second heat sink, wherein the first heat sink and the second heat sink are capacitively grounded and arranged to provide heat dissipation via electron-phonon coupling; and wherein a combined resistance of the at least one tunnel junction and a heat sink coupled to it is below h e 2, and/or a total capacitance of the first heat sink is above e 2 2 k b T and a total capacitance of the second heat sink is above e 2 2 k b T, wherein h is the Planck constant, e is the elementary charge, kb is the Boltzmann constant and T is the minimum temperature, where the attenuator or the dissipating element is arranged to be used. Patent family as of 17.7.2026 AU2022332648 AA, CA3229164 AA, CN117957766 A, DE602022028480 D1, EP4393061 A1, EP4393061 B1, EP4393061 C0, EP4647977 A2, EP4647977 A3, JP2024530270 T2, US2025132482 AA, US2025155295 AA, WO23025985 A1

AB - An attenuator arranged to thermalize radio frequency components, or a dissipating element arranged to thermalize lower frequency components than the radio frequency components, comprising: at least a first heat sink and a second heat sink; and at least one tunnel junction coupled to the first heat sink and the second heat sink, wherein the first heat sink and the second heat sink are capacitively grounded and arranged to provide heat dissipation via electron-phonon coupling; and wherein a combined resistance of the at least one tunnel junction and a heat sink coupled to it is below h e 2, and/or a total capacitance of the first heat sink is above e 2 2 k b T and a total capacitance of the second heat sink is above e 2 2 k b T, wherein h is the Planck constant, e is the elementary charge, kb is the Boltzmann constant and T is the minimum temperature, where the attenuator or the dissipating element is arranged to be used. Patent family as of 17.7.2026 AU2022332648 AA, CA3229164 AA, CN117957766 A, DE602022028480 D1, EP4393061 A1, EP4393061 B1, EP4393061 C0, EP4647977 A2, EP4647977 A3, JP2024530270 T2, US2025132482 AA, US2025155295 AA, WO23025985 A1

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M3 - Patent

M1 - EP4393061 B1

Y2 - 2022/08/23

ER -

An Attenuator or a dissipating element

Abstract

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