An ultra-wideband BGA-via transition for high-speed digital and millimeter-wave packaging applications

Tero Kangasvieri, Jukka Halme, Jouko Vähäkangas, Markku Lahti

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    22 Citations (Scopus)

    Abstract

    This paper presents a high-performance BGA-via transition structure suitable for multilayer system-in-package (SiP) applications over a wide frequency range from DC up to the F-band. The main issues involved in designing and optimizing the entire vertical transition path, starting from a motherboard and ending at the top surface of a BGA module package are outlined. The module substrates were manufactured in a standard, multilayer low-temperature co-fired ceramic (LTCC) process. The ceramic modules with plastic-core solder balls were mounted on a motherboard using standard surface-mount assembly processes. The RF performance of the developed transition structure was validated with on-wafer scattering parameter measurements. The measured results correlated very well with full-wave electromagnetic (EM) simulations, exhibiting return and insertion loss values better than 22 dB and 0.6 dB, respectively, up to 50 GHz. Moreover, the EM simulations demonstrated that the 1-dB cut-off frequency of the complete BGA-via transition structure can be extended from 55 GHz up to nearly 70 GHz at the expense of poorer return loss.
    Original languageEnglish
    Title of host publicationIEEE MTT-S International Microwave Symposium 2007
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages1637-1640
    ISBN (Electronic)978-1-4244-0688-3
    ISBN (Print)978-1-4244-0687-6
    DOIs
    Publication statusPublished - 2007
    MoE publication typeA4 Article in a conference publication
    EventIEEE/MTT-S International Microwave Symposium 2007 - Honolulu, HI, United States
    Duration: 3 Jun 20078 Jun 2007

    Publication series

    SeriesIEEE MTT-S International Microwave Symposium
    ISSN0149-645X

    Conference

    ConferenceIEEE/MTT-S International Microwave Symposium 2007
    Country/TerritoryUnited States
    CityHonolulu, HI
    Period3/06/078/06/07

    Keywords

    • BGA
    • Broadband
    • LTCC
    • Millimeter-wave
    • Transition
    • Via

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