@inproceedings{f64981f2e1d44fa6bdd4c7cd74eef775,
title = "An ultra-wideband BGA-via transition for high-speed digital and millimeter-wave packaging applications",
abstract = "This paper presents a high-performance BGA-via transition structure suitable for multilayer system-in-package (SiP) applications over a wide frequency range from DC up to the F-band. The main issues involved in designing and optimizing the entire vertical transition path, starting from a motherboard and ending at the top surface of a BGA module package are outlined. The module substrates were manufactured in a standard, multilayer low-temperature co-fired ceramic (LTCC) process. The ceramic modules with plastic-core solder balls were mounted on a motherboard using standard surface-mount assembly processes. The RF performance of the developed transition structure was validated with on-wafer scattering parameter measurements. The measured results correlated very well with full-wave electromagnetic (EM) simulations, exhibiting return and insertion loss values better than 22 dB and 0.6 dB, respectively, up to 50 GHz. Moreover, the EM simulations demonstrated that the 1-dB cut-off frequency of the complete BGA-via transition structure can be extended from 55 GHz up to nearly 70 GHz at the expense of poorer return loss.",
keywords = "BGA, Broadband, LTCC, Millimeter-wave, Transition, Via",
author = "Tero Kangasvieri and Jukka Halme and Jouko V{\"a}h{\"a}kangas and Markku Lahti",
year = "2007",
doi = "10.1109/MWSYM.2007.380001",
language = "English",
isbn = "978-1-4244-0687-6",
series = "IEEE MTT-S International Microwave Symposium",
publisher = "IEEE Institute of Electrical and Electronic Engineers",
pages = "1637--1640",
booktitle = "IEEE MTT-S International Microwave Symposium 2007",
address = "United States",
note = "IEEE/MTT-S International Microwave Symposium 2007 ; Conference date: 03-06-2007 Through 08-06-2007",
}