An ultra-wideband BGA-via transition for high-speed digital and millimeter-wave packaging applications

T. Kangasvieri, J. Halme, J. Vähäkangas, Markku Lahti

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    16 Citations (Scopus)

    Abstract

    This paper presents a high-performance BGA-via transition structure suitable for multilayer system-in-package (SiP) applications over a wide frequency range from DC up to the F-band.
    The main issues involved in designing and optimizing the entire vertical transition path, starting from a motherboard and ending at the top surface of a BGA module package are outlined. The module substrates were manufactured in a standard, multilayer low-temperature co-fired ceramic (LTCC) process.
    The ceramic modules with plastic-core solder balls were mounted on a motherboard using standard surface-mount assembly processes. The RF performance of the developed transition structure was validated with on-wafer scattering parameter measurements. The measured results correlated very well with full-wave electromagnetic (EM) simulations, exhibiting return and insertion loss values better than 22 dB and 0.6 dB, respectively, up to 50 GHz.
    Moreover, the EM simulations demonstrated that the 1-dB cut-off frequency of the complete BGA-via transition structure can be extended from 55 GHz up to nearly 70 GHz at the expense of poorer return loss.
    Original languageEnglish
    Title of host publicationProceedings
    Subtitle of host publicationIEEE MTT-S International Microwave Symposium 2007
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages1637-1640
    ISBN (Print)1-4244-0687-0, 1-4244-0688-9
    DOIs
    Publication statusPublished - 2007
    MoE publication typeA4 Article in a conference publication
    EventIEEE/MTT-S International Microwave Symposium 2007 - Honolulu, HI, United States
    Duration: 3 Jun 20078 Jun 2007

    Conference

    ConferenceIEEE/MTT-S International Microwave Symposium 2007
    Country/TerritoryUnited States
    CityHonolulu, HI
    Period3/06/078/06/07

    Keywords

    • BGA
    • Broadband
    • LTCC
    • Millimeter-wave
    • Transition
    • Via

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