Annealing-induced lattice recovery in room-temperature xenon irradiated CeO2: X-ray diffraction and electron energy loss spectroscopy experiments

  • Janne Pakarinen*
  • , Lingfeng He
  • , Abdel Rahman Hassan
  • , Yongqiang Wang
  • , Mahima Gupta
  • , Anter El-Azab
  • , Todd R. Allen
  • *Corresponding author for this work

Research output: Contribution to journalArticleScientificpeer-review

8 Citations (Scopus)

Abstract

A systematic x-ray diffraction (XRD) study was performed on room-temperature Xe-irradiated and postirradiation annealed CeO2. Large scale XRD did not show any additional irradiation-induced phases upon irradiation. Depth profiling the CeO2 (111) diffraction peak over the 150 nm deep Xe-irradiated layer (400 keV, 1 × 1020 Xe/m2) by grazing incidence XRD indicated a lattice expansion at the irradiated layer. Postirradiation annealing (1 h at 1000°C) in an oxygen-containing environment removed the observed XRD features. Electron energy loss spectroscopy (EELS) was performed for cross-sectional samples before and after postirradiation annealing. EELS showed that the Ce charge state changed from +4 to +3 at the CeO2 surface indicating the presence of O vacancies in both as-irradiated and annealed samples. EELS also indicated that the amount of O vacancies was reduced at the irradiated region by annealing. The experimental results are discussed based on electronic properties of CeO2, annihilation of oxygen vacancies, and evolution of irradiation damage.

Original languageEnglish
Pages (from-to)1555-1562
JournalJournal of Materials Research
Volume30
Issue number9
DOIs
Publication statusPublished - 27 Jan 2015
MoE publication typeA1 Journal article-refereed

Keywords

  • electron energy loss spectroscopy (EELS)
  • radiation effects
  • x-ray diffraction (XRD)

Fingerprint

Dive into the research topics of 'Annealing-induced lattice recovery in room-temperature xenon irradiated CeO2: X-ray diffraction and electron energy loss spectroscopy experiments'. Together they form a unique fingerprint.

Cite this