Application of Inkjet printing for 3D integration

Kim Eiroma, Heikki Viljanen

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    5 Citations (Scopus)


    Inkjet printing is an attractive deposition tool to complement the traditional processing methods used in microelectronics integration. Its maskless, digital and non-contact nature provides many generic benefits, such as savings in processing steps and material usage, production flexibility and scalability to large areas. In addition, inkjet printing can be utilized in the integration of e.g. silicon and polymer or paper based systems, such as for the new wave of hybrid large-area, flexible devices, which are out of the scope of traditional clean room processing. In this paper, we study the process of metallization of a Through-Silicon Via hole (TSV) by inkjet deposition. We describe the process of sample preparation and characterization. We finally demonstrate the creation of a fully inkjet printed 3D electrical interconnection using a Kelvin TSV test structure.
    Original languageEnglish
    Title of host publicationNIP & Digital Fabrication Conference
    Subtitle of host publication31st International Conference on Digital Printing Technologies (NIP 31)
    PublisherThe Society for Imaging Science and Technology, IS&T
    ISBN (Print)978-1-5108-1436-3
    Publication statusPublished - 2015
    MoE publication typeA4 Article in a conference publication
    Event31st International Conference on Digital Printing Technologies and Digital Fabrication 2015, NIP 2015 - Portland, United States
    Duration: 27 Sept 20151 Oct 2015
    Conference number: 31


    Conference31st International Conference on Digital Printing Technologies and Digital Fabrication 2015, NIP 2015
    Abbreviated titleNIP 2015
    Country/TerritoryUnited States


    • deposition
    • digital printing
    • electronics packaging
    • ink jet printing
    • integrated circuit interconnects
    • integrated circuit manufacture
    • integration
    • microelectronics
    • processing


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