Application of Inkjet printing for 3D integration

Kim Eiroma, Heikki Viljanen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

3 Citations (Scopus)

Abstract

Inkjet printing is an attractive deposition tool to complement the traditional processing methods used in microelectronics integration. Its maskless, digital and non-contact nature provides many generic benefits, such as savings in processing steps and material usage, production flexibility and scalability to large areas. In addition, inkjet printing can be utilized in the integration of e.g. silicon and polymer or paper based systems, such as for the new wave of hybrid large-area, flexible devices, which are out of the scope of traditional clean room processing. In this paper, we study the process of metallization of a Through-Silicon Via hole (TSV) by inkjet deposition. We describe the process of sample preparation and characterization. We finally demonstrate the creation of a fully inkjet printed 3D electrical interconnection using a Kelvin TSV test structure.
Original languageEnglish
Title of host publicationNIP & Digital Fabrication Conference
Subtitle of host publication31st International Conference on Digital Printing Technologies (NIP 31)
PublisherThe Society for Imaging Science and Technology, IS&T
Pages195-200
Volume2015
ISBN (Print)978-1-5108-1436-3
Publication statusPublished - 2015
MoE publication typeA4 Article in a conference publication
Event31st International Conference on Digital Printing Technologies and Digital Fabrication 2015, NIP 2015 - Portland, United States
Duration: 27 Sep 20151 Oct 2015
Conference number: 31

Publication series

Name
ISSN (Print)2169-4451

Conference

Conference31st International Conference on Digital Printing Technologies and Digital Fabrication 2015, NIP 2015
Abbreviated titleNIP 2015
CountryUnited States
CityPortland
Period27/09/151/10/15

Fingerprint

Printing
Silicon
Processing
Clean rooms
Metallizing
Microelectronics
Scalability
Polymers

Keywords

  • deposition
  • digital printing
  • electronics packaging
  • ink jet printing
  • integrated circuit interconnects
  • integrated circuit manufacture
  • integration
  • microelectronics
  • processing

Cite this

Eiroma, K., & Viljanen, H. (2015). Application of Inkjet printing for 3D integration. In NIP & Digital Fabrication Conference: 31st International Conference on Digital Printing Technologies (NIP 31) (Vol. 2015, pp. 195-200). The Society for Imaging Science and Technology, IS&T.
Eiroma, Kim ; Viljanen, Heikki. / Application of Inkjet printing for 3D integration. NIP & Digital Fabrication Conference: 31st International Conference on Digital Printing Technologies (NIP 31) . Vol. 2015 The Society for Imaging Science and Technology, IS&T, 2015. pp. 195-200
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Eiroma, K & Viljanen, H 2015, Application of Inkjet printing for 3D integration. in NIP & Digital Fabrication Conference: 31st International Conference on Digital Printing Technologies (NIP 31) . vol. 2015, The Society for Imaging Science and Technology, IS&T, pp. 195-200, 31st International Conference on Digital Printing Technologies and Digital Fabrication 2015, NIP 2015, Portland, United States, 27/09/15.

Application of Inkjet printing for 3D integration. / Eiroma, Kim; Viljanen, Heikki.

NIP & Digital Fabrication Conference: 31st International Conference on Digital Printing Technologies (NIP 31) . Vol. 2015 The Society for Imaging Science and Technology, IS&T, 2015. p. 195-200.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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Eiroma K, Viljanen H. Application of Inkjet printing for 3D integration. In NIP & Digital Fabrication Conference: 31st International Conference on Digital Printing Technologies (NIP 31) . Vol. 2015. The Society for Imaging Science and Technology, IS&T. 2015. p. 195-200