Abstract
Inkjet printing is an attractive deposition tool to complement the traditional processing methods used in microelectronics integration. Its maskless, digital and non-contact nature provides many generic benefits, such as savings in processing steps and material usage, production flexibility and scalability to large areas. In addition, inkjet printing can be utilized in the integration of e.g. silicon and polymer or paper based systems, such as for the new wave of hybrid large-area, flexible devices, which are out of the scope of traditional clean room processing. In this paper, we study the process of metallization of a Through-Silicon Via hole (TSV) by inkjet deposition. We describe the process of sample preparation and characterization. We finally demonstrate the creation of a fully inkjet printed 3D electrical interconnection using a Kelvin TSV test structure.
| Original language | English |
|---|---|
| Title of host publication | NIP & Digital Fabrication Conference |
| Subtitle of host publication | 31st International Conference on Digital Printing Technologies (NIP 31) |
| Publisher | The Society for Imaging Science and Technology, IS&T |
| Pages | 195-200 |
| Volume | 2015 |
| ISBN (Print) | 978-1-5108-1436-3 |
| Publication status | Published - 2015 |
| MoE publication type | A4 Article in a conference publication |
| Event | 31st International Conference on Digital Printing Technologies and Digital Fabrication 2015, NIP 2015 - Portland, United States Duration: 27 Sept 2015 → 1 Oct 2015 Conference number: 31 |
Conference
| Conference | 31st International Conference on Digital Printing Technologies and Digital Fabrication 2015, NIP 2015 |
|---|---|
| Abbreviated title | NIP 2015 |
| Country/Territory | United States |
| City | Portland |
| Period | 27/09/15 → 1/10/15 |
Keywords
- deposition
- digital printing
- electronics packaging
- ink jet printing
- integrated circuit interconnects
- integrated circuit manufacture
- integration
- microelectronics
- processing