Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices

K. Zoschke, C-A. Manier, M. Wilke, H. Oppermann, D. Fuffieux, James Dekker, Antti Jaakkola, S. Dalla Piazza, G. Allegato, Klaus-Dieter Lang

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

14 Citations (Scopus)

Abstract

The paper presents different approaches for hermetic wafer level packaging of oscillator components like quartz crystals or silicon resonators. The proposed concepts involve technologies like TSV formation into passive or active silicon wafers, formation of proper bond frames on interposer, ASIC or cap wafers as well as hermetic bonding using AuSn soldering either in wafer to wafer style or with reconfigured components on a carrier wafer.
Original languageEnglish
Title of host publication2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
PublisherIEEE Institute of Electrical and Electronic Engineers
Pages1343-1350
ISBN (Electronic)978-1-4799-8609-5, 978-1-4799-8608-8
DOIs
Publication statusPublished - 16 Jul 2015
MoE publication typeA4 Article in a conference publication
Event65th IEEE Electronic Components and Technology Conference, ECTC 2015 - San Diego, United States
Duration: 26 May 201529 Jun 2015
Conference number: 65

Publication series

SeriesElectronic Components and Technology Conference (ECTC)
Volume65
ISSN0569-5503

Conference

Conference65th IEEE Electronic Components and Technology Conference, ECTC 2015
Abbreviated titleECTC 2015
Country/TerritoryUnited States
CitySan Diego
Period26/05/1529/06/15

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