Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices

K. Zoschke, C-A. Manier, M. Wilke, H. Oppermann, D. Fuffieux, J. Dekker, A. Jaakkola, S. Dalla Piazza, G. Allegato, K-D. Lang

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

10 Citations (Scopus)

Abstract

The paper presents different approaches for hermetic wafer level packaging of oscillator components like quartz crystals or silicon resonators. The proposed concepts involve technologies like TSV formation into passive or active silicon wafers, formation of proper bond frames on interposer, ASIC or cap wafers as well as hermetic bonding using AuSn soldering either in wafer to wafer style or with reconfigured components on a carrier wafer.
Original languageEnglish
Title of host publicationElectronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
PublisherIEEE Institute of Electrical and Electronic Engineers
Pages1343-1350
ISBN (Electronic)978-1-4799-8609-5, 978-1-4799-8608-8
DOIs
Publication statusPublished - 16 Jul 2015
MoE publication typeA4 Article in a conference publication
Event65th IEEE Electronic Components and Technology Conference, ECTC 2015 - San Diego, United States
Duration: 26 May 201529 Jun 2015
Conference number: 65

Conference

Conference65th IEEE Electronic Components and Technology Conference, ECTC 2015
Abbreviated titleECTC 2015
CountryUnited States
CitySan Diego
Period26/05/1529/06/15

Fingerprint

Timing devices
Wafer bonding
Soldering
Application specific integrated circuits
Silicon wafers
MEMS
Quartz
Resonators
Packaging
Silicon
Crystals

Cite this

Zoschke, K., Manier, C-A., Wilke, M., Oppermann, H., Fuffieux, D., Dekker, J., ... Lang, K-D. (2015). Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices. In Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th (pp. 1343-1350). IEEE Institute of Electrical and Electronic Engineers . https://doi.org/10.1109/ECTC.2015.7159772
Zoschke, K. ; Manier, C-A. ; Wilke, M. ; Oppermann, H. ; Fuffieux, D. ; Dekker, J. ; Jaakkola, A. ; Dalla Piazza, S. ; Allegato, G. ; Lang, K-D. / Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices. Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. IEEE Institute of Electrical and Electronic Engineers , 2015. pp. 1343-1350
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abstract = "The paper presents different approaches for hermetic wafer level packaging of oscillator components like quartz crystals or silicon resonators. The proposed concepts involve technologies like TSV formation into passive or active silicon wafers, formation of proper bond frames on interposer, ASIC or cap wafers as well as hermetic bonding using AuSn soldering either in wafer to wafer style or with reconfigured components on a carrier wafer.",
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Zoschke, K, Manier, C-A, Wilke, M, Oppermann, H, Fuffieux, D, Dekker, J, Jaakkola, A, Dalla Piazza, S, Allegato, G & Lang, K-D 2015, Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices. in Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. IEEE Institute of Electrical and Electronic Engineers , pp. 1343-1350, 65th IEEE Electronic Components and Technology Conference, ECTC 2015, San Diego, United States, 26/05/15. https://doi.org/10.1109/ECTC.2015.7159772

Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices. / Zoschke, K.; Manier, C-A.; Wilke, M.; Oppermann, H.; Fuffieux, D.; Dekker, J.; Jaakkola, A.; Dalla Piazza, S.; Allegato, G.; Lang, K-D.

Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. IEEE Institute of Electrical and Electronic Engineers , 2015. p. 1343-1350.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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AU - Allegato, G.

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AB - The paper presents different approaches for hermetic wafer level packaging of oscillator components like quartz crystals or silicon resonators. The proposed concepts involve technologies like TSV formation into passive or active silicon wafers, formation of proper bond frames on interposer, ASIC or cap wafers as well as hermetic bonding using AuSn soldering either in wafer to wafer style or with reconfigured components on a carrier wafer.

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Zoschke K, Manier C-A, Wilke M, Oppermann H, Fuffieux D, Dekker J et al. Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices. In Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. IEEE Institute of Electrical and Electronic Engineers . 2015. p. 1343-1350 https://doi.org/10.1109/ECTC.2015.7159772