Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices

K. Zoschke; C-A. Manier; M. Wilke; H. Oppermann; D. Fuffieux; James Dekker; Antti Jaakkola; S. Dalla Piazza; G. Allegato; Klaus-Dieter Lang

doi:10.1109/ECTC.2015.7159772

Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices

K. Zoschke, C-A. Manier, M. Wilke, H. Oppermann, D. Fuffieux, James Dekker, Antti Jaakkola, S. Dalla Piazza, G. Allegato, Klaus-Dieter Lang

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

18 Citations (Scopus)

Abstract

The paper presents different approaches for hermetic wafer level packaging of oscillator components like quartz crystals or silicon resonators. The proposed concepts involve technologies like TSV formation into passive or active silicon wafers, formation of proper bond frames on interposer, ASIC or cap wafers as well as hermetic bonding using AuSn soldering either in wafer to wafer style or with reconfigured components on a carrier wafer.

Original language	English
Title of host publication	2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	1343-1350
ISBN (Electronic)	978-1-4799-8609-5, 978-1-4799-8608-8
DOIs	https://doi.org/10.1109/ECTC.2015.7159772
Publication status	Published - 16 Jul 2015
MoE publication type	A4 Article in a conference publication
Event	65th IEEE Electronic Components and Technology Conference, ECTC 2015 - San Diego, United States Duration: 26 May 2015 → 29 Jun 2015 Conference number: 65

Publication series

Series	Electronic Components and Technology Conference (ECTC)
Volume	65
ISSN	0569-5503

Conference

Conference	65th IEEE Electronic Components and Technology Conference, ECTC 2015
Abbreviated title	ECTC 2015
Country/Territory	United States
City	San Diego
Period	26/05/15 → 29/06/15

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10.1109/ECTC.2015.7159772

Cite this

Zoschke, K., Manier, C.-A., Wilke, M., Oppermann, H., Fuffieux, D., Dekker, J., Jaakkola, A., Dalla Piazza, S., Allegato, G., & Lang, K.-D. (2015). Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices. In 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (pp. 1343-1350). IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/ECTC.2015.7159772

Zoschke, K. ; Manier, C-A. ; Wilke, M. et al. / Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices. 2015 IEEE 65th Electronic Components and Technology Conference (ECTC). IEEE Institute of Electrical and Electronic Engineers, 2015. pp. 1343-1350 (Electronic Components and Technology Conference (ECTC), Vol. 65).

@inproceedings{004ac8cf9b41480b9a7bb0899dd0d9c5,

title = "Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices",

abstract = "The paper presents different approaches for hermetic wafer level packaging of oscillator components like quartz crystals or silicon resonators. The proposed concepts involve technologies like TSV formation into passive or active silicon wafers, formation of proper bond frames on interposer, ASIC or cap wafers as well as hermetic bonding using AuSn soldering either in wafer to wafer style or with reconfigured components on a carrier wafer.",

author = "K. Zoschke and C-A. Manier and M. Wilke and H. Oppermann and D. Fuffieux and James Dekker and Antti Jaakkola and {Dalla Piazza}, S. and G. Allegato and Klaus-Dieter Lang",

year = "2015",

month = jul,

day = "16",

doi = "10.1109/ECTC.2015.7159772",

language = "English",

series = "Electronic Components and Technology Conference (ECTC)",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

pages = "1343--1350",

booktitle = "2015 IEEE 65th Electronic Components and Technology Conference (ECTC)",

address = "United States",

note = "65th IEEE Electronic Components and Technology Conference, ECTC 2015, ECTC 2015 ; Conference date: 26-05-2015 Through 29-06-2015",

}

Zoschke, K, Manier, C-A, Wilke, M, Oppermann, H, Fuffieux, D, Dekker, J, Jaakkola, A, Dalla Piazza, S, Allegato, G & Lang, K-D 2015, Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices. in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC). IEEE Institute of Electrical and Electronic Engineers, Electronic Components and Technology Conference (ECTC), vol. 65, pp. 1343-1350, 65th IEEE Electronic Components and Technology Conference, ECTC 2015, San Diego, California, United States, 26/05/15. https://doi.org/10.1109/ECTC.2015.7159772

Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices. / Zoschke, K.; Manier, C-A.; Wilke, M. et al.
2015 IEEE 65th Electronic Components and Technology Conference (ECTC). IEEE Institute of Electrical and Electronic Engineers, 2015. p. 1343-1350 (Electronic Components and Technology Conference (ECTC), Vol. 65).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices

AU - Zoschke, K.

AU - Manier, C-A.

AU - Wilke, M.

AU - Oppermann, H.

AU - Fuffieux, D.

AU - Dekker, James

AU - Jaakkola, Antti

AU - Dalla Piazza, S.

AU - Allegato, G.

AU - Lang, Klaus-Dieter

N1 - Conference code: 65

PY - 2015/7/16

Y1 - 2015/7/16

N2 - The paper presents different approaches for hermetic wafer level packaging of oscillator components like quartz crystals or silicon resonators. The proposed concepts involve technologies like TSV formation into passive or active silicon wafers, formation of proper bond frames on interposer, ASIC or cap wafers as well as hermetic bonding using AuSn soldering either in wafer to wafer style or with reconfigured components on a carrier wafer.

AB - The paper presents different approaches for hermetic wafer level packaging of oscillator components like quartz crystals or silicon resonators. The proposed concepts involve technologies like TSV formation into passive or active silicon wafers, formation of proper bond frames on interposer, ASIC or cap wafers as well as hermetic bonding using AuSn soldering either in wafer to wafer style or with reconfigured components on a carrier wafer.

U2 - 10.1109/ECTC.2015.7159772

DO - 10.1109/ECTC.2015.7159772

M3 - Conference article in proceedings

T3 - Electronic Components and Technology Conference (ECTC)

SP - 1343

EP - 1350

BT - 2015 IEEE 65th Electronic Components and Technology Conference (ECTC)

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - 65th IEEE Electronic Components and Technology Conference, ECTC 2015

Y2 - 26 May 2015 through 29 June 2015

ER -

Zoschke K, Manier CA, Wilke M, Oppermann H, Fuffieux D, Dekker J et al. Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices. In 2015 IEEE 65th Electronic Components and Technology Conference (ECTC). IEEE Institute of Electrical and Electronic Engineers. 2015. p. 1343-1350. (Electronic Components and Technology Conference (ECTC), Vol. 65). doi: 10.1109/ECTC.2015.7159772

Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices

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