Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices

Keyphrases

• Wafer-level Packaging 100%
• MEMS Components 100%
• Timing Device 100%
• TSV Integration 100%
• Wafer Bonding Technology 100%
• Wafer-to-wafer 50%
• Silicon Wafer 50%
• Interposer 50%
• Wafer 50%
• Silicon Resonator 50%
• AuSn 50%
• Quartz Crystal Resonator 50%
• Soldering 50%
• Carrier Wafer 50%
• Active Silicon 50%

INIS

• levels 100%
• applications 100%
• bonding 100%
• devices 100%
• silicon 100%
• packaging 100%
• crystals 50%
• quartz 50%
• oscillators 50%
• resonators 50%
• carriers 50%
• soldering 50%

Engineering

• Level Packaging 100%
• Wafer Bonding 100%
• Bonding Technology 100%
• Microelectromechanical System 100%
• Quartz Crystal 50%
• Cap Wafer 50%
• Interposer 50%
• Application Specific Integrated Circuit 50%
• Resonator 50%
• Silicon Wafer 50%
• Oscillator 50%