Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices

K. Zoschke, C-A. Manier, M. Wilke, H. Oppermann, D. Fuffieux, J. Dekker, A. Jaakkola, S. Dalla Piazza, G. Allegato, K-D. Lang

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

10 Citations (Scopus)

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Engineering & Materials Science