Atomic layer deposited thin barrier films for packaging

Marja Pitkänen, Mika Vähä-Nissi, Erkki Salo, Jenni Sievänen, Eija Kenttä, Matti Putkonen, Marjaana Rättö, Ali Harlin

Research output: Chapter in Book/Report/Conference proceedingConference abstract in proceedingsScientific

Abstract

Atomic layer deposition (ALD) is a surface controlled layer-by-layer process based on self-limiting gas-solid reactions. Thin films are prepared using volatile precursors in repeating cycles until a preferred film thickness is obtained. ALD is suited for producing dense and pinhole-free inorganic films uniform in thickness. Most important commercial applications lies today in microelectronics, but they range from displays to protective coatings on silver jewellery. The purpose of this presentation is to demonstrate both the potential and the challenges of using ALD to create thin barrier layers for packaging materials. ALD can have a profound effect on the barrier values of various polymer films and polymer coated paperboards. As far as safety issues are concerned, these thin barrier films seem not to fall under the European definition of nanotechnology and migration is low enough to meet the requirements set by current European regulations. ALD can also be used to create antimicrobial thin films, and thin oxide films can be modified for improved mechanical and surface properties. It is recommended that ALD deposited thin films are protected with an additional polymer layer also providing heat sealability. Although ALD is today carried out in batch mode, the development of roll-to-roll processes will enhance the techno-economic feasibility of ALD, among others, for packaging materials.
Original languageEnglish
Title of host publicationPTS Symposium, Innovative Packaging 2014, Joint conference of PTS and COST Action FP1003
Subtitle of host publication Abstracts PTS GV 1473
Place of PublicationMunich, Germany
Pages71 - 86
Publication statusPublished - 2014
EventPTS Symposium of Innovative Packaging: Joint conference of PTS and COST Action FP1003 - München, Germany
Duration: 20 May 201421 May 2014

Conference

ConferencePTS Symposium of Innovative Packaging
CountryGermany
CityMünchen
Period20/05/1421/05/14

Fingerprint

atomic layer epitaxy
packaging
polymers
thin films
protective coatings
pinholes
barrier layers
nanotechnology
microelectronics
surface properties
oxide films
economics
safety
film thickness
silver
mechanical properties
heat
requirements
cycles
gases

Keywords

  • atomic layer deposition
  • barriers
  • food packaging
  • polymer films
  • packaging materials

Cite this

Pitkänen, M., Vähä-Nissi, M., Salo, E., Sievänen, J., Kenttä, E., Putkonen, M., ... Harlin, A. (2014). Atomic layer deposited thin barrier films for packaging. In PTS Symposium, Innovative Packaging 2014, Joint conference of PTS and COST Action FP1003: Abstracts PTS GV 1473 (pp. 71 - 86). Munich, Germany.
Pitkänen, Marja ; Vähä-Nissi, Mika ; Salo, Erkki ; Sievänen, Jenni ; Kenttä, Eija ; Putkonen, Matti ; Rättö, Marjaana ; Harlin, Ali. / Atomic layer deposited thin barrier films for packaging. PTS Symposium, Innovative Packaging 2014, Joint conference of PTS and COST Action FP1003: Abstracts PTS GV 1473. Munich, Germany, 2014. pp. 71 - 86
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author = "Marja Pitk{\"a}nen and Mika V{\"a}h{\"a}-Nissi and Erkki Salo and Jenni Siev{\"a}nen and Eija Kentt{\"a} and Matti Putkonen and Marjaana R{\"a}tt{\"o} and Ali Harlin",
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Pitkänen, M, Vähä-Nissi, M, Salo, E, Sievänen, J, Kenttä, E, Putkonen, M, Rättö, M & Harlin, A 2014, Atomic layer deposited thin barrier films for packaging. in PTS Symposium, Innovative Packaging 2014, Joint conference of PTS and COST Action FP1003: Abstracts PTS GV 1473. Munich, Germany, pp. 71 - 86, PTS Symposium of Innovative Packaging, München, Germany, 20/05/14.

Atomic layer deposited thin barrier films for packaging. / Pitkänen, Marja; Vähä-Nissi, Mika; Salo, Erkki; Sievänen, Jenni; Kenttä, Eija; Putkonen, Matti; Rättö, Marjaana; Harlin, Ali.

PTS Symposium, Innovative Packaging 2014, Joint conference of PTS and COST Action FP1003: Abstracts PTS GV 1473. Munich, Germany, 2014. p. 71 - 86.

Research output: Chapter in Book/Report/Conference proceedingConference abstract in proceedingsScientific

TY - CHAP

T1 - Atomic layer deposited thin barrier films for packaging

AU - Pitkänen, Marja

AU - Vähä-Nissi, Mika

AU - Salo, Erkki

AU - Sievänen, Jenni

AU - Kenttä, Eija

AU - Putkonen, Matti

AU - Rättö, Marjaana

AU - Harlin, Ali

PY - 2014

Y1 - 2014

N2 - Atomic layer deposition (ALD) is a surface controlled layer-by-layer process based on self-limiting gas-solid reactions. Thin films are prepared using volatile precursors in repeating cycles until a preferred film thickness is obtained. ALD is suited for producing dense and pinhole-free inorganic films uniform in thickness. Most important commercial applications lies today in microelectronics, but they range from displays to protective coatings on silver jewellery. The purpose of this presentation is to demonstrate both the potential and the challenges of using ALD to create thin barrier layers for packaging materials. ALD can have a profound effect on the barrier values of various polymer films and polymer coated paperboards. As far as safety issues are concerned, these thin barrier films seem not to fall under the European definition of nanotechnology and migration is low enough to meet the requirements set by current European regulations. ALD can also be used to create antimicrobial thin films, and thin oxide films can be modified for improved mechanical and surface properties. It is recommended that ALD deposited thin films are protected with an additional polymer layer also providing heat sealability. Although ALD is today carried out in batch mode, the development of roll-to-roll processes will enhance the techno-economic feasibility of ALD, among others, for packaging materials.

AB - Atomic layer deposition (ALD) is a surface controlled layer-by-layer process based on self-limiting gas-solid reactions. Thin films are prepared using volatile precursors in repeating cycles until a preferred film thickness is obtained. ALD is suited for producing dense and pinhole-free inorganic films uniform in thickness. Most important commercial applications lies today in microelectronics, but they range from displays to protective coatings on silver jewellery. The purpose of this presentation is to demonstrate both the potential and the challenges of using ALD to create thin barrier layers for packaging materials. ALD can have a profound effect on the barrier values of various polymer films and polymer coated paperboards. As far as safety issues are concerned, these thin barrier films seem not to fall under the European definition of nanotechnology and migration is low enough to meet the requirements set by current European regulations. ALD can also be used to create antimicrobial thin films, and thin oxide films can be modified for improved mechanical and surface properties. It is recommended that ALD deposited thin films are protected with an additional polymer layer also providing heat sealability. Although ALD is today carried out in batch mode, the development of roll-to-roll processes will enhance the techno-economic feasibility of ALD, among others, for packaging materials.

KW - atomic layer deposition

KW - barriers

KW - food packaging

KW - polymer films

KW - packaging materials

M3 - Conference abstract in proceedings

SP - 71

EP - 86

BT - PTS Symposium, Innovative Packaging 2014, Joint conference of PTS and COST Action FP1003

CY - Munich, Germany

ER -

Pitkänen M, Vähä-Nissi M, Salo E, Sievänen J, Kenttä E, Putkonen M et al. Atomic layer deposited thin barrier films for packaging. In PTS Symposium, Innovative Packaging 2014, Joint conference of PTS and COST Action FP1003: Abstracts PTS GV 1473. Munich, Germany. 2014. p. 71 - 86