Atomic layer deposition of thin inorganic coatings onto renewable packaging materials

Mika Vähä-Nissi, Terhi Hirvikorpi, Jenni Sievänen, Katriina Matilainen, Erkki Salo, Ali Harlin

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

5 Citations (Scopus)

Abstract

Biopolymers play still a relatively minor role in the packaging material markets. For this to grow further there are problems to be solved, such as inadequate barrier properties and moisture sensitivity. Atomic layer deposition (ALD) is one potential solution. Atomic layer deposition is a layer-by-layer thin film deposition process based on self-limiting gas-solid reactions. It is well suited for producing pinhole free barrier coatings uniform in thickness at relatively mild process conditions. The purpose of this presentation is to summarize our recent work done concerning atomic layer deposition of thin aluminum oxide layers onto biopolymers
Original languageEnglish
Title of host publicationAdvanced Structural and Functional Materials for Protection, ICMAT 2011
EditorsMe Jan, Santhiagu Ezhilvalavan
Pages12-14
DOIs
Publication statusPublished - 2012
MoE publication typeA4 Article in a conference publication

Publication series

SeriesSolid State Phenomena
Volume185
ISSN1012-0394

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Keywords

  • Aluminum oxide
  • atomic layer deposition
  • barrier
  • biopolymer
  • packaging material

Cite this

Vähä-Nissi, M., Hirvikorpi, T., Sievänen, J., Matilainen, K., Salo, E., & Harlin, A. (2012). Atomic layer deposition of thin inorganic coatings onto renewable packaging materials. In M. Jan, & S. Ezhilvalavan (Eds.), Advanced Structural and Functional Materials for Protection, ICMAT 2011 (pp. 12-14). Solid State Phenomena, Vol.. 185 https://doi.org/10.4028/www.scientific.net/SSP.185.12