@inproceedings{2762a38ca72a45469aa6da13f9bed2b1,
title = "Atomic layer deposition of thin inorganic coatings onto renewable packaging materials",
abstract = "Biopolymers play still a relatively minor role in the packaging material markets. For this to grow further there are problems to be solved, such as inadequate barrier properties and moisture sensitivity. Atomic layer deposition (ALD) is one potential solution. Atomic layer deposition is a layer-by-layer thin film deposition process based on self-limiting gas-solid reactions. It is well suited for producing pinhole free barrier coatings uniform in thickness at relatively mild process conditions. The purpose of this presentation is to summarize our recent work done concerning atomic layer deposition of thin aluminum oxide layers onto biopolymers",
keywords = "Aluminum oxide, atomic layer deposition, barrier, biopolymer, packaging material",
author = "Mika V{\"a}h{\"a}-Nissi and Terhi Hirvikorpi and Jenni Siev{\"a}nen and Katriina Matilainen and Erkki Salo and Ali Harlin",
year = "2012",
doi = "10.4028/www.scientific.net/SSP.185.12",
language = "English",
isbn = "978-3-03785-365-8",
series = "Solid State Phenomena",
publisher = "Trans Tech Publications Ltd",
pages = "12--14",
editor = "Me Jan and Santhiagu Ezhilvalavan",
booktitle = "Advanced Structural and Functional Materials for Protection, ICMAT 2011",
}