Abstract
Biopolymers play still a relatively minor role in the
packaging material markets. For this to grow further
there are problems to be solved, such as inadequate
barrier properties and moisture sensitivity. Atomic layer
deposition (ALD) is one potential solution. Atomic layer
deposition is a layer-by-layer thin film deposition
process based on self-limiting gas-solid reactions. It is
well suited for producing pinhole free barrier coatings
uniform in thickness at relatively mild process
conditions. The purpose of this presentation is to
summarize our recent work done concerning atomic layer
deposition of thin aluminum oxide layers onto biopolymers
| Original language | English |
|---|---|
| Title of host publication | Advanced Structural and Functional Materials for Protection, ICMAT 2011 |
| Editors | Me Jan, Santhiagu Ezhilvalavan |
| Pages | 12-14 |
| DOIs | |
| Publication status | Published - 2012 |
| MoE publication type | A4 Article in a conference publication |
Publication series
| Series | Solid State Phenomena |
|---|---|
| Volume | 185 |
| ISSN | 1012-0394 |
Funding
Project code: 42240
Keywords
- Aluminum oxide
- atomic layer deposition
- barrier
- biopolymer
- packaging material
Fingerprint
Dive into the research topics of 'Atomic layer deposition of thin inorganic coatings onto renewable packaging materials'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver