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Barrier slurry compositions and barrier cmp methods
Philippe Monnoyer
(Inventor)
Not published at VTT
Freescale Semiconductor Inc.
Research output
:
Patent
›
Patent application
Overview
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Dive into the research topics of 'Barrier slurry compositions and barrier cmp methods'. Together they form a unique fingerprint.
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Keyphrases
Barrier Slurry
100%
Slurry Composition
100%
Abrasive
40%
Capping Layer
40%
Layer Materials
40%
Barrier Layer Material
40%
Removal Rate
20%
Hydrogen Peroxide
20%
Material Layer
20%
Colloidal Silica
20%
Sodium
20%
Corrosion Inhibitor
20%
Citrate
20%
Metal Layer
20%
Oxidizing Agent
20%
Complexing Agent
20%
Preferential Removal
20%
Ammonium Nitrate
20%
Benzotriazole
20%
ULK Dielectric Materials
20%
Ultra Low-k Dielectrics
20%
Sulfosuccinate
20%
Engineering
Cap Layer
100%
Dielectrics
100%
Barrier Layer
100%
Cmp Method
100%
Removal Rate
50%
Material Layer
50%
Metal Layer
50%
Complexing Agent
50%
Colloidal Silica
50%
INIS
barriers
100%
slurries
100%
removal
50%
layers
33%
additives
33%
barrier layer
33%
abrasives
33%
dielectric materials
33%
water
16%
metals
16%
silica
16%
hydrogen peroxide
16%
sodium
16%
corrosion inhibitors
16%
citrates
16%
ammonium nitrates
16%
oxidizing agents
16%
complexing agents
16%
Material Science
Dielectric Material
100%
Corrosion Inhibitor
50%
Silicon Dioxide
50%
Sodium
50%
Hydrogen Peroxide
50%