Bend-size reduction on the SOI rib waveguide platform

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    2 Citations (Scopus)

    Abstract

    The minimum bending radius of optical waveguides is typically the most important parameter that defines the footprint and cost of a photonic integrated circuit. In optical fibers and in planar waveguides with equally large mode fields (~10 μm) the bending radii are typically in the cm-scale. The main advantage of using a high index waveguide core with a thickness below 1 μm is the ability to realise single-mode bends with bending radii of just a few micrometers. In this paper we review the dependence of the minimum bending radius on the size and shape of waveguides with the main emphasis on silicon-on-insulator (SOI) waveguides. Then we present simulation and measurement results from advanced waveguide bends and mirrors that have been integrated with 4-10 μm thick single-mode SOI waveguides. We show that multi-step patterning and novel designs allow the reduction of the bending radius by up to three orders of magnitude while also reducing the bending losses by approximately one order of magnitude when compared to traditional rib waveguide bends on 4 μm SOI. This allows to use the μm-scale SOI waveguides for making almost as compact photonic integrated circuits as those based on sub-μm SOI waveguides.
    Original languageEnglish
    Title of host publicationSilicon Photonics VIII
    PublisherInternational Society for Optics and Photonics SPIE
    ISBN (Print)978-0-8194-9398-9
    DOIs
    Publication statusPublished - 2013
    MoE publication typeA4 Article in a conference publication
    EventSPIE Opto - San Francisco, California, United States
    Duration: 2 Feb 20137 Feb 2013

    Publication series

    SeriesProceedings of SPIE
    Volume8629
    ISSN0277-786X

    Conference

    ConferenceSPIE Opto
    CountryUnited States
    CitySan Francisco, California
    Period2/02/137/02/13

    Keywords

    • Silicon photonics; silicon-on-insulator; SOI waveg

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