Bias-induced stress transitions in sputtered TiN films

Keyphrases

• TiN Film 100%
• Induced Stress 100%
• Titanium Nitride Film 100%
• Stress Transition 100%
• Low Stress 50%
• Stress Property 50%
• Magnetron Sputtering 50%
• In Films 50%
• High Pressure 50%
• Resistivity 50%
• Stress Relief 50%
• Film Formation 50%
• Intrinsic Stress 50%
• Processing Parameters 50%
• Diffusion Barrier 50%
• Low-cost Substrates 50%
• Sputtering Gas 50%
• Film Density 50%
• Substrate Bias Voltage 50%

Material Science

• Nitride Compound 100%
• Titanium 100%
• Electrical Resistivity 50%
• Film 50%
• Density 50%
• Silicon 50%
• Film Growth 50%
• Aluminum 50%

INIS

• films 100%
• tin 100%
• titanium nitrides 33%
• density 16%
• silicon 16%
• substrates 16%
• processing 16%
• voltage 16%
• gases 16%
• magnetrons 16%
• sputtering 16%
• high pressure 16%
• aluminum 16%
• diffusion barriers 16%