Biocompatible ALD barrier coatings for medical devices

Mikko Matvejeff, Satu Ek, Riina Ritasalo, Jesse Kalliomäki, Päivi Järvinen, Oili Ylivaara, Erik Östreng

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    1 Citation (Scopus)


    Atomic layer deposition (ALD) is widely in use for depositing a variety of materials, such as metal oxides, metal nitrides and metals, in a conformal and defect-free form at low temperatures on high aspect-ratio substrates. These advantages make ALD uniquely powerful method for applications where sensitive substrate materials combine with extreme demands on coating quality and temperature/chemical resistance, such as those often seen in the medical applications.
    Original languageEnglish
    Title of host publicationProceedings of 2017 IEEE Electron Devices Technology and Manufacturing Conference (EDTM)
    PublisherIEEE Institute of Electrical and Electronic Engineers
    ISBN (Electronic)978-1-5090-4660-7
    ISBN (Print)978-1-5090-4661-4
    Publication statusPublished - 13 Jun 2017
    MoE publication typeA4 Article in a conference publication
    EventElectron Devices Technology and Manufacturing Coneference, EDTM 2017 - Toyama, Japan
    Duration: 28 Feb 20172 Mar 2017


    ConferenceElectron Devices Technology and Manufacturing Coneference, EDTM 2017
    Abbreviated titleEDTM 2017


    • atomic layer deposition
    • ALD
    • medical device and barrier layer
    • otanano


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