Projects per year
Abstract
Atomic layer deposition (ALD) is widely in use for
depositing a variety of materials, such as metal oxides,
metal nitrides and metals, in a conformal and defect-free
form at low temperatures on high aspect-ratio substrates.
These advantages make ALD uniquely powerful method for
applications where sensitive substrate materials combine
with extreme demands on coating quality and
temperature/chemical resistance, such as those often seen
in the medical applications.
Original language | English |
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Title of host publication | Proceedings of 2017 IEEE Electron Devices Technology and Manufacturing Conference (EDTM) |
Publisher | IEEE Institute of Electrical and Electronic Engineers |
Pages | 56-58 |
ISBN (Electronic) | 978-1-5090-4660-7 |
ISBN (Print) | 978-1-5090-4661-4 |
DOIs | |
Publication status | Published - 13 Jun 2017 |
MoE publication type | A4 Article in a conference publication |
Event | Electron Devices Technology and Manufacturing Coneference, EDTM 2017 - Toyama, Japan Duration: 28 Feb 2017 → 2 Mar 2017 |
Conference
Conference | Electron Devices Technology and Manufacturing Coneference, EDTM 2017 |
---|---|
Abbreviated title | EDTM 2017 |
Country/Territory | Japan |
City | Toyama |
Period | 28/02/17 → 2/03/17 |
Funding
Keywords
- atomic layer deposition
- ALD
- medical device and barrier layer
- otanano
Fingerprint
Dive into the research topics of 'Biocompatible ALD barrier coatings for medical devices'. Together they form a unique fingerprint.Projects
- 1 Finished
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InForMed: An integrated pilot line for micro-fabricated medical devices
Kärkkäinen, A. (PI)
1/06/15 → 30/09/18
Project: EU project