Bipolar photodiode module operated at 4 K

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    3 Citations (Scopus)

    Abstract

    An optoelectronic module for generating high frequency bipolar current pulses at 4 K was developed. Bipolar signals are generated by connecting a pair of photodiodes in series to coplanar waveguides on silicon. The transmission line pulse propagation was simulated in COMSOL. A planar optical fiber connector was fabricated, where the end fiber faces where angle polished to reflect the beam perpendicular to the fiber. An assembled prototype was fabricated by flip-chip bonding photodiodes to the silicon photodiode carrier. The optical connector was aligned and bonded using epoxy. The prototype was tested using a mode-locked laser producing pulses with sub-20 ps pulses. Bipolar output pulses were generated at 4 K and measured using an oscilloscope. The measured output pulses were affected by ringing and were broader than the reference signal. Comparison with simulations indicate that the ringing was caused by reflections at wirebonds.
    Original languageEnglish
    Title of host publication2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020
    PublisherIEEE Institute of Electrical and Electronic Engineers
    ISBN (Electronic)978-1-7281-6293-5
    ISBN (Print)978-1-7281-6294-2
    DOIs
    Publication statusPublished - 23 Oct 2020
    MoE publication typeA4 Article in a conference publication
    Event8th IEEE Electronics System-Integration Technology Conference, ESTC 2020: Online - Virtual, Tonsberg, Vestfold, Norway
    Duration: 15 Sept 202018 Sept 2020

    Conference

    Conference8th IEEE Electronics System-Integration Technology Conference, ESTC 2020
    Country/TerritoryNorway
    CityTonsberg, Vestfold
    Period15/09/2018/09/20

    Funding

    This work was supported by the EU within the EMPIR JRPs QuADC. The EMPIR is jointly funded in part by the EMPIR participating countries within EURAMET and in part by the European Union. TF received funding from the Academy of Finland (grants 296476 and 306844). The work is part of the Academy of Finland Flagship Programme, Photonics Research and Innovation (PREIN), decision 320168.

    Keywords

    • Cryogenics
    • Flip-chip bonding
    • Optoelectronics
    • Packaging
    • Photodiodes
    • RF measurements
    • RF simulation
    • Voltage metrology

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