Bonded and mechanically thinned pre-etched SOI structures

Tommi Suni, Kimmo Henttinen, Hannu Luoto, James Dekker, Jari Mäkinen, Altti Torkkeli

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Original language	English
Title of host publication	EuroSOI2006, conference proceedings
Pages	121-122
Publication status	Published - 2006
MoE publication type	Not Eligible
Event	EuroSOI 2006 - Grenoble, France Duration: 8 Mar 2006 → 10 Mar 2006

Cite this

Suni, T., Henttinen, K., Luoto, H., Dekker, J., Mäkinen, J., & Torkkeli, A. (2006). Bonded and mechanically thinned pre-etched SOI structures. In EuroSOI2006, conference proceedings (pp. 121-122)

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title = "Bonded and mechanically thinned pre-etched SOI structures",

keywords = "Pre-patterned SOI, wafer bonding, mechanical thinning",

author = "Tommi Suni and Kimmo Henttinen and Hannu Luoto and James Dekker and Jari M{\"a}kinen and Altti Torkkeli",

note = "No ISBN or other bibliographic metadata found for the proceedings; EuroSOI 2006 ; Conference date: 08-03-2006 Through 10-03-2006",

year = "2006",

language = "English",

pages = "121--122",

booktitle = "EuroSOI2006, conference proceedings",

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AU - Suni, Tommi

AU - Henttinen, Kimmo

AU - Luoto, Hannu

AU - Dekker, James

AU - Mäkinen, Jari

AU - Torkkeli, Altti

N1 - No ISBN or other bibliographic metadata found for the proceedings

PY - 2006

Y1 - 2006

KW - Pre-patterned SOI

KW - wafer bonding

KW - mechanical thinning

M3 - Conference article in proceedings

SP - 121

EP - 122

BT - EuroSOI2006, conference proceedings

T2 - EuroSOI 2006

Y2 - 8 March 2006 through 10 March 2006

ER -