Bonding structure, photonic integrated circuit, and method for active alignment of optical axis of semiconductor optical device with optical axis of optical circuit on substrate

A bonding structure (100) and a method for active alignment of an optical axis (OAX1) of a semiconductor optical device (20) with an optical axis (OAX2) of an optical circuit (30) on a substrate (10), and a photonic integrated circuit (110). The bonding structure (100) comprises at least one first bonding member (11) on the substrate (10) for first bonding the semiconductor optical device (20) to the substrate (10), wherein the first bonding member (11) is made of material, such as porous metal, exhibiting plastic deformation to allow deforming of the at least one first bonding member (11) during the active alignment. Furthermore, the bonding structure (100) comprises at least one second bonding member (12) on the substrate (10) for second bonding the semiconductor optical device (20) to the substrate (10) upon completion or after the active alignment.

Patent family as of 14.7.2026
EP4548139 A1, EP4548139 B1, FI20225594 A, JP2025520676 T2, WO24003442 A1