Bonding structure

Jae-Wung Lee

Bonding structure

Jae-Wung Lee (Inventor)

BA6215 Photonics and superconductive electronics

Research output: Patent › Patent

Abstract

According to an example aspect of the present invention, there is provided a bonding structure for forming at least one electrical connection between an optoelectronic component and a photonic substrate. The bonding structure comprises a pillar structure between the optoelectronic component and the photonic substrate, and a bonding layer comprising bonding material on the pillar structure. The pillar structure for at least one individual electrical connection comprises at least two portions and at least one gap between the portions for receiving extra bonding material of the bonding layer.

Patent family as of 17.7.2026
EP4367541 A1, FI130884 B, FI20215791 A, US12573810 BB, US2025006684 AA, WO23281161 A1

Original language	English
Patent number	US12573810 B2
IPC	H01L23/00
Priority date	6/07/21
Filing date	30/06/22
Publication status	Published - 10 Mar 2026
MoE publication type	H1 Granted patent

Cite this

@misc{5e88c85a28ea4ddab15b9e4fb66c5bf0,

title = "Bonding structure",

abstract = "According to an example aspect of the present invention, there is provided a bonding structure for forming at least one electrical connection between an optoelectronic component and a photonic substrate. The bonding structure comprises a pillar structure between the optoelectronic component and the photonic substrate, and a bonding layer comprising bonding material on the pillar structure. The pillar structure for at least one individual electrical connection comprises at least two portions and at least one gap between the portions for receiving extra bonding material of the bonding layer. Patent family as of 17.7.2026 EP4367541 A1, FI130884 B, FI20215791 A, US12573810 BB, US2025006684 AA, WO23281161 A1",

author = "Jae-Wung Lee",

year = "2026",

month = mar,

day = "10",

language = "English",

type = "Patent",

note = "US12573810 B2; H01L23/00",

}

TY - PAT

T1 - Bonding structure

AU - Lee, Jae-Wung

PY - 2026/3/10

Y1 - 2026/3/10

N2 - According to an example aspect of the present invention, there is provided a bonding structure for forming at least one electrical connection between an optoelectronic component and a photonic substrate. The bonding structure comprises a pillar structure between the optoelectronic component and the photonic substrate, and a bonding layer comprising bonding material on the pillar structure. The pillar structure for at least one individual electrical connection comprises at least two portions and at least one gap between the portions for receiving extra bonding material of the bonding layer. Patent family as of 17.7.2026 EP4367541 A1, FI130884 B, FI20215791 A, US12573810 BB, US2025006684 AA, WO23281161 A1

AB - According to an example aspect of the present invention, there is provided a bonding structure for forming at least one electrical connection between an optoelectronic component and a photonic substrate. The bonding structure comprises a pillar structure between the optoelectronic component and the photonic substrate, and a bonding layer comprising bonding material on the pillar structure. The pillar structure for at least one individual electrical connection comprises at least two portions and at least one gap between the portions for receiving extra bonding material of the bonding layer. Patent family as of 17.7.2026 EP4367541 A1, FI130884 B, FI20215791 A, US12573810 BB, US2025006684 AA, WO23281161 A1

UR - https://fi.espacenet.com/publicationDetails/biblio?II=0&ND=3&adjacent=true&locale=fi_FI&FT=D&date=20250102&CC=US&NR=2025006684A1&KC=A1

M3 - Patent

M1 - US12573810 B2

Y2 - 2022/06/30

ER -

Bonding structure

Abstract

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