@inproceedings{781d323d1b14444fa79c4d1548f66dd3,
title = "Broadband and polarization independent waveguide-fiber coupling",
abstract = "Waveguide-to-fiber coupling is one of the key challenges in silicon photonics. Many approaches have already been experimentally demonstrated, such as grating couplers, inverse tapers, sub-wavelength structures, lensed fibers, photonic wire bonds, small-core fibers and separate waveguide interposers. However, it is difficult to find a concept that simultaneously offers broadband operation, polarization independency, low optical loss, simple fabrication and easy assembly. In this paper, the pros and cons of different concepts are reviewed. Then two alternative concepts are introduced for coupling light between 3 µm thick SOI waveguides and standard single-mode fibers with ultra-broadband (>500 nm bandwidth) and polarization independent operation. Experimental results with 1-2 dB loss per waveguide-fiber interface are reported for 1) separate 12 µm SOI interposers and 2) polymer lenses directly written to the end facets of the 3 µm SOI waveguides. The insertion loss of the interposer concept includes both the waveguide-interposer and interposer-fiber interfaces, as well as the loss of the interposer itself. The loss of the polymer lens concept includes the losses of the waveguide-to-lens, lens-to-air and air-to-fiber interfaces, as well as the loss of the directly written lens. Polymer lenses were also integrated on top of up-reflecting mirrors to demonstrate vertical fiber coupling. The scalability of the two concepts for low-cost silicon photonics packaging is also analyzed, taking into account the ability to align fibers passively into V-grooves or others such structures on the SOI chips.",
keywords = "anti-reflection coating, fiber coupling, optical interposer, polymer lens, Silicon photonics, silicon-on-insulator",
author = "Timo Aalto and Tomi Hassinen and Markku Kapulainen and Aki M{\"a}yr{\"a} and Hannu Vasama and P{\"a}ivi Heimala",
note = "Funding Information: This work has been mostly carried out under the PICAP project, where it was partly funded by Business Finland (decision 44065/31/2020). It is part of the Academy of Finland Flagship Programme, Photonics Research and Innovation (PREIN). Publisher Copyright: {\textcopyright} 2023 SPIE.; Silicon Photonics XVIII 2023 ; Conference date: 30-01-2023 Through 01-02-2023",
year = "2023",
doi = "10.1117/12.2651389",
language = "English",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "International Society for Optics and Photonics SPIE",
editor = "Reed, {Graham T.} and Knights, {Andrew P.}",
booktitle = "Silicon Photonics XVIII",
address = "United States",
}