Broadband BGA-via transitions for reliable RF/microwave LTCC-SiP module packaging

Tero Kangasvieri; J. Halme; J. Vähäkangas; Markku Lahti

doi:10.1109/LMWC.2007.911986

Broadband BGA-via transitions for reliable RF/microwave LTCC-SiP module packaging

Tero Kangasvieri, J. Halme, J. Vähäkangas, Markku Lahti

University of Oulu

Research output: Contribution to journal › Article › Scientific › peer-review

31 Citations (Scopus)

Abstract

This letter presents two broadband ball grid array-via transition structures applicable in reliable radio frequency/microwave low-temperature co-fired ceramic system-in-package (LTCC-SiP) module packaging from dc up to the K-band. The first transition provides better electromagnetic shielding, while the second one exhibits 40% wider bandwidth by including an air-cavity in the LTCC module. To specifically address board-level reliability, novel plastic-core solder balls as large as 1100 mum were employed. The measured 1-dB cutoff frequencies of the transition structures, all the way from the printed circuit board up to the top surface of the module package, were 19 and 27 GHz. In addition, equivalent circuit models for the transitions were developed.

Original language	English
Pages (from-to)	34 - 36
Number of pages	3
Journal	IEEE Microwave and Wireless Components Letters
Volume	18
Issue number	1
DOIs	https://doi.org/10.1109/LMWC.2007.911986
Publication status	Published - 2008
MoE publication type	A1 Journal article-refereed

Keywords

Ball grid array (BGA)
Broadband
Low-temperature co-fired ceramic (LTCC)
Microwave
Transit

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10.1109/LMWC.2007.911986

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title = "Broadband BGA-via transitions for reliable RF/microwave LTCC-SiP module packaging",

abstract = "This letter presents two broadband ball grid array-via transition structures applicable in reliable radio frequency/microwave low-temperature co-fired ceramic system-in-package (LTCC-SiP) module packaging from dc up to the K-band. The first transition provides better electromagnetic shielding, while the second one exhibits 40% wider bandwidth by including an air-cavity in the LTCC module. To specifically address board-level reliability, novel plastic-core solder balls as large as 1100 mum were employed. The measured 1-dB cutoff frequencies of the transition structures, all the way from the printed circuit board up to the top surface of the module package, were 19 and 27 GHz. In addition, equivalent circuit models for the transitions were developed.",

keywords = "Ball grid array (BGA), Broadband, Low-temperature co-fired ceramic (LTCC), Microwave, Transit",

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AU - Vähäkangas, J.

AU - Lahti, Markku

PY - 2008

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AB - This letter presents two broadband ball grid array-via transition structures applicable in reliable radio frequency/microwave low-temperature co-fired ceramic system-in-package (LTCC-SiP) module packaging from dc up to the K-band. The first transition provides better electromagnetic shielding, while the second one exhibits 40% wider bandwidth by including an air-cavity in the LTCC module. To specifically address board-level reliability, novel plastic-core solder balls as large as 1100 mum were employed. The measured 1-dB cutoff frequencies of the transition structures, all the way from the printed circuit board up to the top surface of the module package, were 19 and 27 GHz. In addition, equivalent circuit models for the transitions were developed.

KW - Ball grid array (BGA)

KW - Broadband

KW - Low-temperature co-fired ceramic (LTCC)

KW - Microwave

KW - Transit

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DO - 10.1109/LMWC.2007.911986

M3 - Article

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JO - IEEE Microwave and Wireless Components Letters

JF - IEEE Microwave and Wireless Components Letters

IS - 1

ER -

Broadband BGA-via transitions for reliable RF/microwave LTCC-SiP module packaging

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Keywords

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