Broadband BGA-via transitions for reliable RF/microwave LTCC-SiP module packaging

Tero Kangasvieri, J. Halme, J. Vähäkangas, Markku Lahti

Research output: Contribution to journalArticleScientificpeer-review

18 Citations (Scopus)

Abstract

This letter presents two broadband ball grid array-via transition structures applicable in reliable radio frequency/microwave low-temperature co-fired ceramic system-in-package (LTCC-SiP) module packaging from dc up to the K-band. The first transition provides better electromagnetic shielding, while the second one exhibits 40% wider bandwidth by including an air-cavity in the LTCC module. To specifically address board-level reliability, novel plastic-core solder balls as large as 1100 mum were employed. The measured 1-dB cutoff frequencies of the transition structures, all the way from the printed circuit board up to the top surface of the module package, were 19 and 27 GHz. In addition, equivalent circuit models for the transitions were developed.
Original languageEnglish
Pages (from-to)34 - 36
Number of pages3
JournalIEEE Microwave and Wireless Components Letters
Volume18
Issue number1
DOIs
Publication statusPublished - 2008
MoE publication typeA1 Journal article-refereed

Fingerprint

Electromagnetic shielding
Ball grid arrays
Microwave frequencies
Cutoff frequency
packaging
Equivalent circuits
Printed circuit boards
Soldering alloys
Packaging
modules
Microwaves
ceramics
Plastics
broadband
Bandwidth
microwaves
Air
balls
electromagnetic shielding
Temperature

Keywords

  • Ball grid array (BGA)
  • Broadband
  • Low-temperature co-fired ceramic (LTCC)
  • Microwave
  • Transit

Cite this

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title = "Broadband BGA-via transitions for reliable RF/microwave LTCC-SiP module packaging",
abstract = "This letter presents two broadband ball grid array-via transition structures applicable in reliable radio frequency/microwave low-temperature co-fired ceramic system-in-package (LTCC-SiP) module packaging from dc up to the K-band. The first transition provides better electromagnetic shielding, while the second one exhibits 40{\%} wider bandwidth by including an air-cavity in the LTCC module. To specifically address board-level reliability, novel plastic-core solder balls as large as 1100 mum were employed. The measured 1-dB cutoff frequencies of the transition structures, all the way from the printed circuit board up to the top surface of the module package, were 19 and 27 GHz. In addition, equivalent circuit models for the transitions were developed.",
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Broadband BGA-via transitions for reliable RF/microwave LTCC-SiP module packaging. / Kangasvieri, Tero; Halme, J.; Vähäkangas, J.; Lahti, Markku.

In: IEEE Microwave and Wireless Components Letters, Vol. 18, No. 1, 2008, p. 34 - 36.

Research output: Contribution to journalArticleScientificpeer-review

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AB - This letter presents two broadband ball grid array-via transition structures applicable in reliable radio frequency/microwave low-temperature co-fired ceramic system-in-package (LTCC-SiP) module packaging from dc up to the K-band. The first transition provides better electromagnetic shielding, while the second one exhibits 40% wider bandwidth by including an air-cavity in the LTCC module. To specifically address board-level reliability, novel plastic-core solder balls as large as 1100 mum were employed. The measured 1-dB cutoff frequencies of the transition structures, all the way from the printed circuit board up to the top surface of the module package, were 19 and 27 GHz. In addition, equivalent circuit models for the transitions were developed.

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KW - Low-temperature co-fired ceramic (LTCC)

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