Fingerprint
Dive into the research topics of 'Broadband BGA-via transitions for reliable RF/microwave LTCC-SiP module packaging'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Broadband BGA-via transitions for reliable RF/microwave LTCC-SiP module packaging
Tero Kangasvieri, J. Halme, J. Vähäkangas, Markku Lahti
Research output: Contribution to journal › Article › Scientific › peer-review
28
Citations
(Scopus)