Building blocks of a flip-chip integrated superconducting quantum processor

Sandoko Kosen; Hang Xi Li; Marcus Rommel; Daryoush Shiri; Christopher Warren; Leif Grönberg; Jaakko Salonen; Tahereh Abad; Janka Biznárová; Marco Caputo; Liangyu Chen; Kestutis Grigoras; Göran Johansson; Anton Frisk Kockum; Christian Križan; Daniel Pérez Lozano; Graham J. Norris; Amr Osman; Jorge Fernández-Pendás; Alberto Ronzani; Anita Fadavi Roudsari; Slawomir Simbierowicz; Giovanna Tancredi; Andreas Wallraff; Christopher Eichler; Joonas Govenius; Jonas Bylander

doi:10.1088/2058-9565/ac734b

Building blocks of a flip-chip integrated superconducting quantum processor

Sandoko Kosen^*, Hang Xi Li, Marcus Rommel, Daryoush Shiri, Christopher Warren, Leif Grönberg, Jaakko Salonen, Tahereh Abad, Janka Biznárová, Marco Caputo, Liangyu Chen, Kestutis Grigoras, Göran Johansson, Anton Frisk Kockum, Christian Križan, Daniel Pérez Lozano, Graham J. Norris, Amr Osman, Jorge Fernández-Pendás, Alberto RonzaniAnita Fadavi Roudsari, Slawomir Simbierowicz, Giovanna Tancredi, Andreas Wallraff, Christopher Eichler, Joonas Govenius, Jonas Bylander

^*Corresponding author for this work

Research output: Contribution to journal › Article › Scientific › peer-review

54 Citations (Scopus)

Abstract

We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips - one quantum chip and one control chip - that are bump-bonded together. We demonstrate time-averaged coherence times exceeding 90 μs, single-qubit gate fidelities exceeding 99.9%, and two-qubit gate fidelities above 98.6%. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baseline state-of-the-art in single-chip, planar circuits. This integration technique can be extended to the realisation of quantum processors accommodating hundreds of qubits in one module as it offers adequate input/output wiring access to all qubits and couplers.

Original language	English
Article number	035018
Journal	Quantum Science and Technology
Volume	7
Issue number	3
DOIs	https://doi.org/10.1088/2058-9565/ac734b
Publication status	Published - Jun 2022
MoE publication type	A1 Journal article-refereed

Funding

We acknowledge the use of support and resources from Myfab Chalmers, and Chalmers Centre for Computational Science and Engineering (C3SE, partially funded by the Swedish Research Council through Grant Agreement No. 2018-05973). This work was funded by the EU Flagship on Quantum Technology H2020-FETFLAG-2018-03 project 820363 OpenSuperQ and by the Knut and Alice Wallenberg (KAW) Foundation through the Wallenberg Centre for Quantum Technology (WACQT).

Keywords

coherence times
design and simulation
flip-chip integration
gate fidelities
superconducting qubit
transmon

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10.1088/2058-9565/ac734bLicence: CC BY

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Kosen, S., Li, H. X., Rommel, M., Shiri, D., Warren, C., Grönberg, L., Salonen, J., Abad, T., Biznárová, J., Caputo, M., Chen, L., Grigoras, K., Johansson, G., Kockum, A. F., Križan, C., Lozano, D. P., Norris, G. J., Osman, A., Fernández-Pendás, J., ... Bylander, J. (2022). Building blocks of a flip-chip integrated superconducting quantum processor. Quantum Science and Technology, 7(3), Article 035018. https://doi.org/10.1088/2058-9565/ac734b

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title = "Building blocks of a flip-chip integrated superconducting quantum processor",

abstract = "We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips - one quantum chip and one control chip - that are bump-bonded together. We demonstrate time-averaged coherence times exceeding 90 μs, single-qubit gate fidelities exceeding 99.9%, and two-qubit gate fidelities above 98.6%. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baseline state-of-the-art in single-chip, planar circuits. This integration technique can be extended to the realisation of quantum processors accommodating hundreds of qubits in one module as it offers adequate input/output wiring access to all qubits and couplers.",

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author = "Sandoko Kosen and Li, {Hang Xi} and Marcus Rommel and Daryoush Shiri and Christopher Warren and Leif Gr{\"o}nberg and Jaakko Salonen and Tahereh Abad and Janka Bizn{\'a}rov{\'a} and Marco Caputo and Liangyu Chen and Kestutis Grigoras and G{\"o}ran Johansson and Kockum, {Anton Frisk} and Christian Kri{\v z}an and Lozano, {Daniel P{\'e}rez} and Norris, {Graham J.} and Amr Osman and Jorge Fern{\'a}ndez-Pend{\'a}s and Alberto Ronzani and Roudsari, {Anita Fadavi} and Slawomir Simbierowicz and Giovanna Tancredi and Andreas Wallraff and Christopher Eichler and Joonas Govenius and Jonas Bylander",

year = "2022",

month = jun,

doi = "10.1088/2058-9565/ac734b",

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Kosen, S, Li, HX, Rommel, M, Shiri, D, Warren, C, Grönberg, L, Salonen, J, Abad, T, Biznárová, J, Caputo, M, Chen, L, Grigoras, K, Johansson, G, Kockum, AF, Križan, C, Lozano, DP, Norris, GJ, Osman, A, Fernández-Pendás, J, Ronzani, A, Roudsari, AF, Simbierowicz, S, Tancredi, G, Wallraff, A, Eichler, C, Govenius, J & Bylander, J 2022, 'Building blocks of a flip-chip integrated superconducting quantum processor', Quantum Science and Technology, vol. 7, no. 3, 035018. https://doi.org/10.1088/2058-9565/ac734b

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AU - Kosen, Sandoko

AU - Li, Hang Xi

AU - Rommel, Marcus

AU - Shiri, Daryoush

AU - Warren, Christopher

AU - Grönberg, Leif

AU - Salonen, Jaakko

AU - Abad, Tahereh

AU - Biznárová, Janka

AU - Caputo, Marco

AU - Chen, Liangyu

AU - Grigoras, Kestutis

AU - Johansson, Göran

AU - Kockum, Anton Frisk

AU - Križan, Christian

AU - Lozano, Daniel Pérez

AU - Norris, Graham J.

AU - Osman, Amr

AU - Fernández-Pendás, Jorge

AU - Ronzani, Alberto

AU - Roudsari, Anita Fadavi

AU - Simbierowicz, Slawomir

AU - Tancredi, Giovanna

AU - Wallraff, Andreas

AU - Eichler, Christopher

AU - Govenius, Joonas

AU - Bylander, Jonas

PY - 2022/6

Y1 - 2022/6

N2 - We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips - one quantum chip and one control chip - that are bump-bonded together. We demonstrate time-averaged coherence times exceeding 90 μs, single-qubit gate fidelities exceeding 99.9%, and two-qubit gate fidelities above 98.6%. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baseline state-of-the-art in single-chip, planar circuits. This integration technique can be extended to the realisation of quantum processors accommodating hundreds of qubits in one module as it offers adequate input/output wiring access to all qubits and couplers.

AB - We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips - one quantum chip and one control chip - that are bump-bonded together. We demonstrate time-averaged coherence times exceeding 90 μs, single-qubit gate fidelities exceeding 99.9%, and two-qubit gate fidelities above 98.6%. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baseline state-of-the-art in single-chip, planar circuits. This integration technique can be extended to the realisation of quantum processors accommodating hundreds of qubits in one module as it offers adequate input/output wiring access to all qubits and couplers.

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KW - design and simulation

KW - flip-chip integration

KW - gate fidelities

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U2 - 10.1088/2058-9565/ac734b

DO - 10.1088/2058-9565/ac734b

M3 - Article

AN - SCOPUS:85132695442

SN - 2058-9565

VL - 7

JO - Quantum Science and Technology

JF - Quantum Science and Technology

IS - 3

M1 - 035018

ER -

Building blocks of a flip-chip integrated superconducting quantum processor

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Keywords

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