Capacitive microphone with low-stress polysilicon membrane and high-stress polysilicon backplate

Altti Torkkeli, Outi Rusanen, Jaakko Saarilahti, Heikki Seppä, Hannu Sipola, Jarmo Hietanen

    Research output: Contribution to journalArticleScientificpeer-review

    74 Citations (Scopus)

    Abstract

    A capacitive single-chip silicon microphone with very low-stress polysilicon membrane was fabricated. A mechanism for stress-releasing due to the high stress of the perforated membrane was introduced. With the achieved stress level of 2 MPa, a microphone with the membrane area of 1 mm2 can be optimally designed, although the measured components did not show the optimal resolution due to excessive acoustic resistance. With a membrane area of 1 mm2, the acoustical sensitivity was 4 mV/Pa (at 1 kHz) and the noise equivalent sound level was 33.5 dB (A), which are adequate values for many applications. The packaged components were tested with a thermal cycle between -40 °C and +60 °C, and due to low packaging-related stresses, no buckling of the membranes was observed.

    Original languageEnglish
    Pages (from-to)116-123
    JournalSensors and Actuators A: Physical
    Volume85
    Issue number1
    DOIs
    Publication statusPublished - 25 Aug 2000
    MoE publication typeA1 Journal article-refereed

    Fingerprint

    Microphones
    microphones
    Polysilicon
    membranes
    Membranes
    acoustics
    releasing
    Silicon
    buckling
    Acoustic noise
    packaging
    Buckling
    Packaging
    Acoustics
    chips
    Acoustic waves
    cycles
    sensitivity
    silicon

    Keywords

    • capacitive
    • microphone
    • polysilicon
    • stress

    Cite this

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    title = "Capacitive microphone with low-stress polysilicon membrane and high-stress polysilicon backplate",
    abstract = "A capacitive single-chip silicon microphone with very low-stress polysilicon membrane was fabricated. A mechanism for stress-releasing due to the high stress of the perforated membrane was introduced. With the achieved stress level of 2 MPa, a microphone with the membrane area of 1 mm2 can be optimally designed, although the measured components did not show the optimal resolution due to excessive acoustic resistance. With a membrane area of 1 mm2, the acoustical sensitivity was 4 mV/Pa (at 1 kHz) and the noise equivalent sound level was 33.5 dB (A), which are adequate values for many applications. The packaged components were tested with a thermal cycle between -40 °C and +60 °C, and due to low packaging-related stresses, no buckling of the membranes was observed.",
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    author = "Altti Torkkeli and Outi Rusanen and Jaakko Saarilahti and Heikki Sepp{\"a} and Hannu Sipola and Jarmo Hietanen",
    year = "2000",
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    language = "English",
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    Capacitive microphone with low-stress polysilicon membrane and high-stress polysilicon backplate. / Torkkeli, Altti; Rusanen, Outi; Saarilahti, Jaakko; Seppä, Heikki; Sipola, Hannu; Hietanen, Jarmo.

    In: Sensors and Actuators A: Physical, Vol. 85, No. 1, 25.08.2000, p. 116-123.

    Research output: Contribution to journalArticleScientificpeer-review

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    T1 - Capacitive microphone with low-stress polysilicon membrane and high-stress polysilicon backplate

    AU - Torkkeli, Altti

    AU - Rusanen, Outi

    AU - Saarilahti, Jaakko

    AU - Seppä, Heikki

    AU - Sipola, Hannu

    AU - Hietanen, Jarmo

    PY - 2000/8/25

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    AB - A capacitive single-chip silicon microphone with very low-stress polysilicon membrane was fabricated. A mechanism for stress-releasing due to the high stress of the perforated membrane was introduced. With the achieved stress level of 2 MPa, a microphone with the membrane area of 1 mm2 can be optimally designed, although the measured components did not show the optimal resolution due to excessive acoustic resistance. With a membrane area of 1 mm2, the acoustical sensitivity was 4 mV/Pa (at 1 kHz) and the noise equivalent sound level was 33.5 dB (A), which are adequate values for many applications. The packaged components were tested with a thermal cycle between -40 °C and +60 °C, and due to low packaging-related stresses, no buckling of the membranes was observed.

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