RF-PLATFORM is combining a wide field of R&D activities with a consolidated service action. The partners in the consortium investigate different technologies, develop applications and perform multi project wafer production runs consisting of numerous structures in each technology. The network is open for interested parties, who can join a user club and participate in the MPW’s. Ceramic multilayers are known as very universal PCB's and packages with advanced properties, 3-dimensional functionalities, good RF performance or integration of passives. One of the main technological challenges in RF-Platform is the development of systems-in-package for a couple of applications in combination with RF-MEMS switches. Since LTCC as a highly reliable ceramic interconnection technology enables an increased circuit density and an advanced versatility of functions, it acts as the carrier for the electrical wiring and packaging, contains buried components and structures, waveguides and antenna structures and is last but not least the package for the system with the opportunity of hermetic encapsulation. Partner EADS has developed an 35 GHz LTCC patch antenna module for communication links, steerable by RF-MEMS switches being integrated directly in the system. Additional applications are a 24 GHz sensing system and a radar sensor module in the 79 GHz range. The paper will give an overview about investigations, simulations and measurements performed with the test vehicles and intermediate structures being manufactured in different MPW runs.
|Publication status||Published - 2008|
|MoE publication type||Not Eligible|
|Event||IMAPS Advanced Technology Workshop on RF and Microwave Packaging - San Diego, United States|
Duration: 13 Oct 2008 → 16 Oct 2008
|Conference||IMAPS Advanced Technology Workshop on RF and Microwave Packaging|
|Period||13/10/08 → 16/10/08|
- system in package
- RF MEMS
Bartnitzek, T., Schönlinner, B., Gautier, W., Cheng, S., Rydberg, A., Purtova, T., Qu, G., Feger, T., Janes, J., Vähä-Heikkilä, T., & Afshin, Z. (2008). Ceramic systems in package for RF and microwave. Paper presented at IMAPS Advanced Technology Workshop on RF and Microwave Packaging, San Diego, United States.