Ceramic systems in package for RF and microwave

T. Bartnitzek, B. Schönlinner, W. Gautier, S. Cheng, A. Rydberg, T. Purtova, G. Qu, T. Feger, J. Janes, Tauno Vähä-Heikkilä, Ziaei Afshin

Research output: Contribution to conferenceConference articleScientificpeer-review

Abstract

RF-PLATFORM is combining a wide field of R&D activities with a consolidated service action. The partners in the consortium investigate different technologies, develop applications and perform multi project wafer production runs consisting of numerous structures in each technology. The network is open for interested parties, who can join a user club and participate in the MPW’s. Ceramic multilayers are known as very universal PCB's and packages with advanced properties, 3-dimensional functionalities, good RF performance or integration of passives. One of the main technological challenges in RF-Platform is the development of systems-in-package for a couple of applications in combination with RF-MEMS switches. Since LTCC as a highly reliable ceramic interconnection technology enables an increased circuit density and an advanced versatility of functions, it acts as the carrier for the electrical wiring and packaging, contains buried components and structures, waveguides and antenna structures and is last but not least the package for the system with the opportunity of hermetic encapsulation. Partner EADS has developed an 35 GHz LTCC patch antenna module for communication links, steerable by RF-MEMS switches being integrated directly in the system. Additional applications are a 24 GHz sensing system and a radar sensor module in the 79 GHz range. The paper will give an overview about investigations, simulations and measurements performed with the test vehicles and intermediate structures being manufactured in different MPW runs.
Original languageEnglish
Publication statusPublished - 2008
MoE publication typeNot Eligible
EventIMAPS Advanced Technology Workshop on RF and Microwave Packaging - San Diego, United States
Duration: 13 Oct 200816 Oct 2008

Conference

ConferenceIMAPS Advanced Technology Workshop on RF and Microwave Packaging
CountryUnited States
CitySan Diego
Period13/10/0816/10/08

Keywords

  • LTCC
  • SIP
  • system in package
  • RF MEMS
  • MEMS

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  • Cite this

    Bartnitzek, T., Schönlinner, B., Gautier, W., Cheng, S., Rydberg, A., Purtova, T., Qu, G., Feger, T., Janes, J., Vähä-Heikkilä, T., & Afshin, Z. (2008). Ceramic systems in package for RF and microwave. Paper presented at IMAPS Advanced Technology Workshop on RF and Microwave Packaging, San Diego, United States.