Abstract
RF-PLATFORM is combining a wide field of R&D activities with a
consolidated service action. The
partners in the consortium investigate different technologies, develop
applications and perform multi
project wafer production runs consisting of numerous structures in each
technology. The network is open
for interested parties, who can join a user club and participate in the MPW’s.
Ceramic multilayers are
known as very universal PCB's and packages with advanced properties,
3-dimensional functionalities,
good RF performance or integration of passives.
One of the main technological challenges in RF-Platform is the development of
systems-in-package for a
couple of applications in combination with RF-MEMS switches. Since LTCC as a
highly reliable ceramic
interconnection technology enables an increased circuit density and an
advanced versatility of functions,
it acts as the carrier for the electrical wiring and packaging, contains
buried components and structures,
waveguides and antenna structures and is last but not least the package for
the system with the
opportunity of hermetic encapsulation. Partner EADS has developed an 35 GHz
LTCC patch antenna
module for communication links, steerable by RF-MEMS switches being integrated
directly in the system.
Additional applications are a 24 GHz sensing system and a radar sensor module
in the 79 GHz range.
The paper will give an overview about investigations, simulations and
measurements performed with the
test vehicles and intermediate structures being manufactured in different MPW
runs.
Original language | English |
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Publication status | Published - 2008 |
MoE publication type | Not Eligible |
Event | IMAPS Advanced Technology Workshop on RF and Microwave Packaging - San Diego, United States Duration: 13 Oct 2008 → 16 Oct 2008 |
Conference
Conference | IMAPS Advanced Technology Workshop on RF and Microwave Packaging |
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Country/Territory | United States |
City | San Diego |
Period | 13/10/08 → 16/10/08 |
Keywords
- LTCC
- SIP
- system in package
- RF MEMS
- MEMS