Ceramic systems in package for RF and microwave

T. Bartnitzek, B. Schönlinner, W. Gautier, S. Cheng, A. Rydberg, T. Purtova, G. Qu, T. Feger, J. Janes, Tauno Vähä-Heikkilä, Ziaei Afshin

Research output: Contribution to conferenceConference articleScientificpeer-review

Fingerprint Dive into the research topics of 'Ceramic systems in package for RF and microwave'. Together they form a unique fingerprint.

Engineering & Materials Science