Ceramic systems in package for RF and microwave

T. Bartnitzek, B. Schönlinner, W. Gautier, S. Cheng, A. Rydberg, T. Purtova, G. Qu, T. Feger, J. Janes, Tauno Vähä-Heikkilä, Ziaei Afshin

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    Computer Science

    Material Science