Abstract
Single-crystalline silicon thin film on fused quartz (SOQ) was prepared using a technique based on wafer bonding and mechanically initiated exfoliation. MOSFETs fabricated on the resulting SOQ were characterized. The measured low-field electron effective mobility was ∼1072 cm²/V·s, which is ∼35% higher than that extracted from reported "universal curve" for electron effective mobility. Consistent with the mobility enhancement, a tensile strain of 0.25% in the SOQ was deduced from Raman spectroscopy. At ∼243 cm²/V·s, no enhancement in hole effective mobility was observed.
| Original language | English |
|---|---|
| Pages (from-to) | 607-609 |
| Journal | IEEE Electron Device Letters |
| Volume | 26 |
| Issue number | 9 |
| DOIs | |
| Publication status | Published - 2005 |
| MoE publication type | A1 Journal article-refereed |
Keywords
- ion-cutting
- mobility enhancement
- MOSFETs
- silicon-on-quartz (SOQ)
- strained-silicon
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