Characterization of a fabrication process for the integration of superconducting qubits and rapid-single-flux-quantum circuits

Maria Gabriella Castellano, Leif Grönberg, Pasquale Carelli, Fabio Chiarello, Carlo Cosmelli, Roberto Leoni, Stefano Poletto, Guido Torrioli, Juha Hassel, Panu Helistö

Research output: Contribution to journalArticleScientificpeer-review

18 Citations (Scopus)

Abstract

In order to integrate superconducting qubits with rapid-single-flux-quantum (RSFQ) control circuitry, it is necessary to develop a fabrication process that simultaneously fulfils the requirements of both elements: low critical current density, very low operating temperature (tens of millikelvin) and reduced dissipation on the qubit side; high operation frequency, large stability margins, low dissipated power on the RSFQ side. For this purpose, VTT has developed a fabrication process based on Nb trilayer technology, which allows the on-chip integration of superconducting qubits and RSFQ circuits even at very low temperature. Here we present the characterization (at 4.2 K) of the process from the point of view of the Josephson devices and show that they are suitable to build integrated superconducting qubits.
Original languageEnglish
Pages (from-to)860-864
Number of pages5
JournalSuperconductor Science and Technology
Volume19
DOIs
Publication statusPublished - 2006
MoE publication typeA1 Journal article-refereed

Fingerprint

Fluxes
Fabrication
fabrication
Networks (circuits)
operating temperature
margins
critical current
dissipation
chips
current density
Temperature
requirements

Keywords

  • qubits
  • Josephson junction
  • superconducting junction devices

Cite this

Castellano, Maria Gabriella ; Grönberg, Leif ; Pasquale Carelli ; Chiarello, Fabio ; Cosmelli, Carlo ; Leoni, Roberto ; Poletto, Stefano ; Torrioli, Guido ; Hassel, Juha ; Helistö, Panu. / Characterization of a fabrication process for the integration of superconducting qubits and rapid-single-flux-quantum circuits. In: Superconductor Science and Technology. 2006 ; Vol. 19. pp. 860-864.
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Characterization of a fabrication process for the integration of superconducting qubits and rapid-single-flux-quantum circuits. / Castellano, Maria Gabriella; Grönberg, Leif; Pasquale Carelli; Chiarello, Fabio; Cosmelli, Carlo; Leoni, Roberto; Poletto, Stefano; Torrioli, Guido; Hassel, Juha; Helistö, Panu.

In: Superconductor Science and Technology, Vol. 19, 2006, p. 860-864.

Research output: Contribution to journalArticleScientificpeer-review

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AU - Castellano, Maria Gabriella

AU - Grönberg, Leif

AU - Pasquale Carelli, null

AU - Chiarello, Fabio

AU - Cosmelli, Carlo

AU - Leoni, Roberto

AU - Poletto, Stefano

AU - Torrioli, Guido

AU - Hassel, Juha

AU - Helistö, Panu

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AB - In order to integrate superconducting qubits with rapid-single-flux-quantum (RSFQ) control circuitry, it is necessary to develop a fabrication process that simultaneously fulfils the requirements of both elements: low critical current density, very low operating temperature (tens of millikelvin) and reduced dissipation on the qubit side; high operation frequency, large stability margins, low dissipated power on the RSFQ side. For this purpose, VTT has developed a fabrication process based on Nb trilayer technology, which allows the on-chip integration of superconducting qubits and RSFQ circuits even at very low temperature. Here we present the characterization (at 4.2 K) of the process from the point of view of the Josephson devices and show that they are suitable to build integrated superconducting qubits.

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