Characterization of a semi 3-D sensor coupled to Medipix2

Lukas Tlustos, Juha Kalliopuska, Rafael Ballabriga, Michael Campbell, Simo Eränen, Xavier Llopart

Research output: Contribution to journalArticleScientificpeer-review

7 Citations (Scopus)


A thick semi-3D Si sensor has been characterised after bump-bonding to a Medipix2 read-out chip. The bonding quality measured using a 90Sr-source was found to be excellent .
Comparative measurements with respect to a standard planar Si sensor comprising IV-curves, depletion voltage and energy resolution have been performed. IV-curves and depletion voltages correspond to the values expected from the sensor geometry.
The depletion voltage of the semi-3D sensor is significantly lower than the one of the planar sensor. The energy resolution of the semi-3D device has been found to be lower.
The uniformity of the pixel response has been measured using a pulsed 1060 nm laser.
Original languageEnglish
Pages (from-to)897-901
JournalNuclear Instruments and Methods in Physics Research. Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
Issue number2
Publication statusPublished - 2007
MoE publication typeA1 Journal article-refereed


  • Silicon Radiation Detectors
  • 3D detectors


Dive into the research topics of 'Characterization of a semi 3-D sensor coupled to Medipix2'. Together they form a unique fingerprint.

Cite this