Characterization of Interconnects on Multilayer High Frequency PCB for D-Band

Antti Lamminen, Markku Lahti, David Del Rio, Jussi Säily, Juan F. Sevillano, Vladimir Ermolov

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Abstract

The paper presents the characterization of interconnects for D-band on multilayer high frequency PCBs. The losses demonstrated at 150 GHz for a microstrip line, a coplanar waveguide and a single flip-chip transition are 1.9 dB/cm, 1.8 dB/cm and 0.3 dB (for 60 µm bumps), respectively. The applicability of multilayer high frequency PCB technology as a low cost integration platform for D-band is proven.
Original languageEnglish
Pages1-5
Number of pages5
Publication statusPublished - 16 Mar 2020
MoE publication typeNot Eligible
Event2nd 6G Wireless Summit'20 - Levi, Sirkka, Levi, Finland
Duration: 16 Apr 202020 Apr 2020
https://www.6gsummit.com/

Conference

Conference2nd 6G Wireless Summit'20
CountryFinland
CityLevi
Period16/04/2020/04/20
Internet address

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Keywords

  • integration
  • D-band
  • PCB
  • mm-waves
  • interconnect
  • flip-chip interconnect

Cite this

Lamminen, A., Lahti, M., Del Rio, D., Säily, J., Sevillano, J. F., & Ermolov, V. (2020). Characterization of Interconnects on Multilayer High Frequency PCB for D-Band. 1-5. Paper presented at 2nd 6G Wireless Summit'20, Levi, Finland.