Characterization of interconnects on multilayer high frequency PCB for D-band

Antti Lamminen; Markku Lahti; David Del Rio; Jussi Saily; Juan F. Sevillano; Vladimir Ermolov

doi:10.1109/6GSUMMIT49458.2020.9083918

Characterization of interconnects on multilayer high frequency PCB for D-band

Antti Lamminen, Markku Lahti, David Del Rio, Jussi Saily, Juan F. Sevillano, Vladimir Ermolov

University of Navarra

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

13 Citations (Scopus)

311 Downloads (Pure)

Abstract

The paper presents the characterization of interconnects for D-band on multilayer high frequency PCBs. The losses demonstrated at 150 GHz for a microstrip line, a coplanar waveguide and a single flip-chip transition are 1.9 dB/cm, 1.8 dB/cm and 0.3 dB (for 60 μm bumps), respectively. The applicability of multilayer high frequency PCB technology as a low cost integration platform for D-band is proven.

Original language	English
Title of host publication	2nd 6G Wireless Summit 2020
Subtitle of host publication	Gain Edge for the 6G Era, 6G SUMMIT 2020
Publisher	IEEE Institute of Electrical and Electronic Engineers
ISBN (Electronic)	978-1-7281-6047-4, 978-1-7281-6046-7
ISBN (Print)	978-1-7281-6048-1
DOIs	https://doi.org/10.1109/6GSUMMIT49458.2020.9083918
Publication status	Published - Mar 2020
MoE publication type	A4 Article in a conference publication
Event	2nd 6G Wireless Summit, 6G SUMMIT 2020 - Levi, Lapland, Finland Duration: 17 Mar 2020 → 20 Mar 2020

Conference

Conference	2nd 6G Wireless Summit, 6G SUMMIT 2020
Country/Territory	Finland
City	Levi, Lapland
Period	17/03/20 → 20/03/20

Funding

This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 761390.

Keywords

D-band
Flip-chip interconnect
Integration
Interconnect
Mm-waves
PCB

Access to Document

10.1109/6GSUMMIT49458.2020.9083918

6GSUMMIT49458.2020.9083918Final published version, 475 KB

Cite this

@inproceedings{a747123a22314ab8bcc823395fd8e217,

title = "Characterization of interconnects on multilayer high frequency PCB for D-band",

abstract = "The paper presents the characterization of interconnects for D-band on multilayer high frequency PCBs. The losses demonstrated at 150 GHz for a microstrip line, a coplanar waveguide and a single flip-chip transition are 1.9 dB/cm, 1.8 dB/cm and 0.3 dB (for 60 μm bumps), respectively. The applicability of multilayer high frequency PCB technology as a low cost integration platform for D-band is proven.",

keywords = "D-band, Flip-chip interconnect, Integration, Interconnect, Mm-waves, PCB",

author = "Antti Lamminen and Markku Lahti and {Del Rio}, David and Jussi Saily and Sevillano, {Juan F.} and Vladimir Ermolov",

note = "Funding Information: This project has received funding from the European Union{\textquoteright}s Horizon 2020 research and innovation programme under grant agreement No 761390. Publisher Copyright: {\textcopyright} 2020 IEEE.; 2nd 6G Wireless Summit, 6G SUMMIT 2020 ; Conference date: 17-03-2020 Through 20-03-2020",

year = "2020",

month = mar,

doi = "10.1109/6GSUMMIT49458.2020.9083918",

language = "English",

isbn = "978-1-7281-6048-1",

booktitle = "2nd 6G Wireless Summit 2020",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

}

Lamminen, A , Lahti, M, Del Rio, D, Saily, J, Sevillano, JF & Ermolov, V 2020, Characterization of interconnects on multilayer high frequency PCB for D-band. in 2nd 6G Wireless Summit 2020: Gain Edge for the 6G Era, 6G SUMMIT 2020., 9083918, IEEE Institute of Electrical and Electronic Engineers, 2nd 6G Wireless Summit, 6G SUMMIT 2020, Levi, Lapland, Finland, 17/03/20. https://doi.org/10.1109/6GSUMMIT49458.2020.9083918

Characterization of interconnects on multilayer high frequency PCB for D-band. / Lamminen, Antti ; Lahti, Markku; Del Rio, David et al.
2nd 6G Wireless Summit 2020: Gain Edge for the 6G Era, 6G SUMMIT 2020. IEEE Institute of Electrical and Electronic Engineers, 2020. 9083918.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Characterization of interconnects on multilayer high frequency PCB for D-band

AU - Lamminen, Antti

AU - Lahti, Markku

AU - Del Rio, David

AU - Saily, Jussi

AU - Sevillano, Juan F.

AU - Ermolov, Vladimir

PY - 2020/3

Y1 - 2020/3

N2 - The paper presents the characterization of interconnects for D-band on multilayer high frequency PCBs. The losses demonstrated at 150 GHz for a microstrip line, a coplanar waveguide and a single flip-chip transition are 1.9 dB/cm, 1.8 dB/cm and 0.3 dB (for 60 μm bumps), respectively. The applicability of multilayer high frequency PCB technology as a low cost integration platform for D-band is proven.

AB - The paper presents the characterization of interconnects for D-band on multilayer high frequency PCBs. The losses demonstrated at 150 GHz for a microstrip line, a coplanar waveguide and a single flip-chip transition are 1.9 dB/cm, 1.8 dB/cm and 0.3 dB (for 60 μm bumps), respectively. The applicability of multilayer high frequency PCB technology as a low cost integration platform for D-band is proven.

KW - D-band

KW - Flip-chip interconnect

KW - Integration

KW - Interconnect

KW - Mm-waves

KW - PCB

UR - http://www.scopus.com/inward/record.url?scp=85086302467&partnerID=8YFLogxK

U2 - 10.1109/6GSUMMIT49458.2020.9083918

DO - 10.1109/6GSUMMIT49458.2020.9083918

M3 - Conference article in proceedings

AN - SCOPUS:85086302467

SN - 978-1-7281-6048-1

BT - 2nd 6G Wireless Summit 2020

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - 2nd 6G Wireless Summit, 6G SUMMIT 2020

Y2 - 17 March 2020 through 20 March 2020

ER -

Characterization of interconnects on multilayer high frequency PCB for D-band

Abstract

Conference

Funding

Keywords

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Patch Antenna and Antenna Array on Multilayer High-Frequency PCB for D-Band

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