Characterization of interconnects on multilayer high frequency PCB for D-band

Antti Lamminen, Markku Lahti, David Del Rio, Jussi Saily, Juan F. Sevillano, Vladimir Ermolov

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

9 Citations (Scopus)
157 Downloads (Pure)


The paper presents the characterization of interconnects for D-band on multilayer high frequency PCBs. The losses demonstrated at 150 GHz for a microstrip line, a coplanar waveguide and a single flip-chip transition are 1.9 dB/cm, 1.8 dB/cm and 0.3 dB (for 60 μm bumps), respectively. The applicability of multilayer high frequency PCB technology as a low cost integration platform for D-band is proven.

Original languageEnglish
Title of host publication2nd 6G Wireless Summit 2020
Subtitle of host publicationGain Edge for the 6G Era, 6G SUMMIT 2020
PublisherIEEE Institute of Electrical and Electronic Engineers
ISBN (Electronic)978-1-7281-6047-4, 978-1-7281-6046-7
ISBN (Print)978-1-7281-6048-1
Publication statusPublished - Mar 2020
MoE publication typeA4 Article in a conference publication
Event2nd 6G Wireless Summit, 6G SUMMIT 2020 - Levi, Lapland, Finland
Duration: 17 Mar 202020 Mar 2020


Conference2nd 6G Wireless Summit, 6G SUMMIT 2020
CityLevi, Lapland


  • D-band
  • Flip-chip interconnect
  • Integration
  • Interconnect
  • Mm-waves
  • PCB


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