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Characterization of Ni/SnPb-TiW/Pt flip chip interconnections in silicon pixel detector modules

  • A. Karadzhinova*
  • , A. Nolvi
  • , Jaakko Härkönen
  • , Panja Luukka
  • , Teppo Mäenpää
  • , Eija Tuominen
  • , E. Hæggström
  • , Juha Kalliopuska
  • , S. Vähänen
  • , I. Kassamakov
    • *Corresponding author for this work
  • University of Helsinki
  • Advacam Oy

Research output: Contribution to journal › Article in a proceedings journal › Scientific › peer-review

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