Characterization of thin film adhesion by MEMS shaft-loading blister testing

M. Berdova (Corresponding Author), J. Lyytinen, Kestutis Grigoras, A. Baby, Lauri Kilpi, Helena Ronkainen, S. Franssila, J. Koskinen

    Research output: Contribution to journalArticleScientificpeer-review

    14 Citations (Scopus)


    A new microelectromechanical system shaft-loaded blister test was developed and demonstrated to provide stability, repeatability, and simultaneous quantitative measurements of adhesion between thin films deposited on a silicon substrate. The authors assessed adhesion of sputtered platinum, copper, and chromium/copper (300 nm) to underlaying atomic layer deposited (ALD) aluminum oxide. The average adhesion energies for thin films on ALD aluminum oxide were found to be 1.15 ± 0.1 J/m2 for platinum thin films, 1.4 J/m2 for copper thin films, and 1.75 J/m2 for chromium/copper.
    Original languageEnglish
    Article number031102
    Number of pages5
    JournalJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
    Issue number3
    Publication statusPublished - 2013
    MoE publication typeA1 Journal article-refereed


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