A new microelectromechanical system shaft-loaded blister test was developed and demonstrated to provide stability, repeatability, and simultaneous quantitative measurements of adhesion between thin films deposited on a silicon substrate. The authors assessed adhesion of sputtered platinum, copper, and chromium/copper (300 nm) to underlaying atomic layer deposited (ALD) aluminum oxide. The average adhesion energies for thin films on ALD aluminum oxide were found to be 1.15 ± 0.1 J/m2 for platinum thin films, 1.4 J/m2 for copper thin films, and 1.75 J/m2 for chromium/copper.
|Number of pages||5|
|Journal||Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films|
|Publication status||Published - 2013|
|MoE publication type||A1 Journal article-refereed|
Berdova, M., Lyytinen, J., Grigoras, K., Baby, A., Kilpi, L., Ronkainen, H., Franssila, S., & Koskinen, J. (2013). Characterization of thin film adhesion by MEMS shaft-loading blister testing. Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, 31(3), . https://doi.org/10.1116/1.4801921