Characterization of thin film adhesion by MEMS shaft-loading blister testing

M. Berdova (Corresponding Author), J. Lyytinen, Kestutis Grigoras, A. Baby, Lauri Kilpi, Helena Ronkainen, S. Franssila, J. Koskinen

Research output: Contribution to journalArticleScientificpeer-review

12 Citations (Scopus)

Abstract

A new microelectromechanical system shaft-loaded blister test was developed and demonstrated to provide stability, repeatability, and simultaneous quantitative measurements of adhesion between thin films deposited on a silicon substrate. The authors assessed adhesion of sputtered platinum, copper, and chromium/copper (300 nm) to underlaying atomic layer deposited (ALD) aluminum oxide. The average adhesion energies for thin films on ALD aluminum oxide were found to be 1.15 ± 0.1 J/m2 for platinum thin films, 1.4 J/m2 for copper thin films, and 1.75 J/m2 for chromium/copper.
Original languageEnglish
Article number031102
Number of pages5
JournalJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Volume31
Issue number3
DOIs
Publication statusPublished - 2013
MoE publication typeA1 Journal article-refereed

Fingerprint

blisters
microelectromechanical systems
MEMS
Copper
adhesion
Adhesion
Thin films
copper
Aluminum Oxide
Testing
Chromium
thin films
Platinum
chromium
platinum
aluminum oxides
Aluminum
Oxides
Silicon
silicon

Cite this

@article{0654762d8ecb438d8e68899faf6fc4e8,
title = "Characterization of thin film adhesion by MEMS shaft-loading blister testing",
abstract = "A new microelectromechanical system shaft-loaded blister test was developed and demonstrated to provide stability, repeatability, and simultaneous quantitative measurements of adhesion between thin films deposited on a silicon substrate. The authors assessed adhesion of sputtered platinum, copper, and chromium/copper (300 nm) to underlaying atomic layer deposited (ALD) aluminum oxide. The average adhesion energies for thin films on ALD aluminum oxide were found to be 1.15 ± 0.1 J/m2 for platinum thin films, 1.4 J/m2 for copper thin films, and 1.75 J/m2 for chromium/copper.",
author = "M. Berdova and J. Lyytinen and Kestutis Grigoras and A. Baby and Lauri Kilpi and Helena Ronkainen and S. Franssila and J. Koskinen",
note = "Project code: 74717",
year = "2013",
doi = "10.1116/1.4801921",
language = "English",
volume = "31",
journal = "Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films",
issn = "0734-2101",
publisher = "American Vacuum Society AVS",
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}

Characterization of thin film adhesion by MEMS shaft-loading blister testing. / Berdova, M. (Corresponding Author); Lyytinen, J.; Grigoras, Kestutis; Baby, A.; Kilpi, Lauri; Ronkainen, Helena; Franssila, S.; Koskinen, J.

In: Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, Vol. 31, No. 3, 031102, 2013.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - Characterization of thin film adhesion by MEMS shaft-loading blister testing

AU - Berdova, M.

AU - Lyytinen, J.

AU - Grigoras, Kestutis

AU - Baby, A.

AU - Kilpi, Lauri

AU - Ronkainen, Helena

AU - Franssila, S.

AU - Koskinen, J.

N1 - Project code: 74717

PY - 2013

Y1 - 2013

N2 - A new microelectromechanical system shaft-loaded blister test was developed and demonstrated to provide stability, repeatability, and simultaneous quantitative measurements of adhesion between thin films deposited on a silicon substrate. The authors assessed adhesion of sputtered platinum, copper, and chromium/copper (300 nm) to underlaying atomic layer deposited (ALD) aluminum oxide. The average adhesion energies for thin films on ALD aluminum oxide were found to be 1.15 ± 0.1 J/m2 for platinum thin films, 1.4 J/m2 for copper thin films, and 1.75 J/m2 for chromium/copper.

AB - A new microelectromechanical system shaft-loaded blister test was developed and demonstrated to provide stability, repeatability, and simultaneous quantitative measurements of adhesion between thin films deposited on a silicon substrate. The authors assessed adhesion of sputtered platinum, copper, and chromium/copper (300 nm) to underlaying atomic layer deposited (ALD) aluminum oxide. The average adhesion energies for thin films on ALD aluminum oxide were found to be 1.15 ± 0.1 J/m2 for platinum thin films, 1.4 J/m2 for copper thin films, and 1.75 J/m2 for chromium/copper.

U2 - 10.1116/1.4801921

DO - 10.1116/1.4801921

M3 - Article

VL - 31

JO - Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

JF - Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

SN - 0734-2101

IS - 3

M1 - 031102

ER -