Characterization of thin film adhesion by MEMS shaft-loading blister testing

Maria Berdova; Jussi Lyytinen; Kestutis Grigoras; Anu Baby; Lauri Kilpi; Helena Ronkainen; Sami Franssila; Jari Koskinen

doi:10.1116/1.4801921

Characterization of thin film adhesion by MEMS shaft-loading blister testing

Maria Berdova^*, Jussi Lyytinen, Kestutis Grigoras, Anu Baby, Lauri Kilpi, Helena Ronkainen, Sami Franssila, Jari Koskinen

^*Corresponding author for this work

Aalto University

Research output: Contribution to journal › Article › Scientific › peer-review

18 Citations (Scopus)

Abstract

A new microelectromechanical system shaft-loaded blister test was developed and demonstrated to provide stability, repeatability, and simultaneous quantitative measurements of adhesion between thin films deposited on a silicon substrate. The authors assessed adhesion of sputtered platinum, copper, and chromium/copper (300 nm) to underlaying atomic layer deposited (ALD) aluminum oxide. The average adhesion energies for thin films on ALD aluminum oxide were found to be 1.15 ± 0.1 J/m² for platinum thin films, 1.4 J/m² for copper thin films, and 1.75 J/m² for chromium/copper.

Original language	English
Article number	031102
Number of pages	5
Journal	Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Volume	31
Issue number	3
DOIs	https://doi.org/10.1116/1.4801921
Publication status	Published - 2013
MoE publication type	A1 Journal article-refereed

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title = "Characterization of thin film adhesion by MEMS shaft-loading blister testing",

abstract = "A new microelectromechanical system shaft-loaded blister test was developed and demonstrated to provide stability, repeatability, and simultaneous quantitative measurements of adhesion between thin films deposited on a silicon substrate. The authors assessed adhesion of sputtered platinum, copper, and chromium/copper (300 nm) to underlaying atomic layer deposited (ALD) aluminum oxide. The average adhesion energies for thin films on ALD aluminum oxide were found to be 1.15 ± 0.1 J/m2 for platinum thin films, 1.4 J/m2 for copper thin films, and 1.75 J/m2 for chromium/copper.",

author = "Maria Berdova and Jussi Lyytinen and Kestutis Grigoras and Anu Baby and Lauri Kilpi and Helena Ronkainen and Sami Franssila and Jari Koskinen",

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doi = "10.1116/1.4801921",

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T1 - Characterization of thin film adhesion by MEMS shaft-loading blister testing

AU - Berdova, Maria

AU - Lyytinen, Jussi

AU - Grigoras, Kestutis

AU - Baby, Anu

AU - Kilpi, Lauri

AU - Ronkainen, Helena

AU - Franssila, Sami

AU - Koskinen, Jari

N1 - Project code: 74717

PY - 2013

Y1 - 2013

N2 - A new microelectromechanical system shaft-loaded blister test was developed and demonstrated to provide stability, repeatability, and simultaneous quantitative measurements of adhesion between thin films deposited on a silicon substrate. The authors assessed adhesion of sputtered platinum, copper, and chromium/copper (300 nm) to underlaying atomic layer deposited (ALD) aluminum oxide. The average adhesion energies for thin films on ALD aluminum oxide were found to be 1.15 ± 0.1 J/m2 for platinum thin films, 1.4 J/m2 for copper thin films, and 1.75 J/m2 for chromium/copper.

AB - A new microelectromechanical system shaft-loaded blister test was developed and demonstrated to provide stability, repeatability, and simultaneous quantitative measurements of adhesion between thin films deposited on a silicon substrate. The authors assessed adhesion of sputtered platinum, copper, and chromium/copper (300 nm) to underlaying atomic layer deposited (ALD) aluminum oxide. The average adhesion energies for thin films on ALD aluminum oxide were found to be 1.15 ± 0.1 J/m2 for platinum thin films, 1.4 J/m2 for copper thin films, and 1.75 J/m2 for chromium/copper.

U2 - 10.1116/1.4801921

DO - 10.1116/1.4801921

M3 - Article

SN - 0734-2101

VL - 31

JO - Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

JF - Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

IS - 3

M1 - 031102

ER -

Characterization of thin film adhesion by MEMS shaft-loading blister testing

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