Abstract
VTT has developed a straightforward and fast process to fabricate edgeless (active edge) microstrip and pixel detectors on 6" (150 mm) wafers. The presentation summarizes the fabrication process of 150 ?m thick p-on-n and n-on-n prototypes having dead layer at the edge below a micron. Electrical and radiation response characterization of 1.4x1.4 cm2 edgeless detectors has been done by coupling them to the Medipix2 readout chips. The leakage currents were measured to be ~90 nA/cm2. Radiation response characterization includes a X-ray tube and source responses. These results show that the edge response depends dramatically on the active edge distance from the nearest pixels.
Original language | English |
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Publication status | Published - 2010 |
MoE publication type | Not Eligible |
Event | 5th "Trento" Workshop on Advanced Silicon Radiation Detectors - Manchester, United Kingdom Duration: 24 Feb 2010 → 26 Feb 2010 |
Conference
Conference | 5th "Trento" Workshop on Advanced Silicon Radiation Detectors |
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Country/Territory | United Kingdom |
City | Manchester |
Period | 24/02/10 → 26/02/10 |
Keywords
- ion-implantation
- edgeless detector
- Medipix2