Abstract
High performance porous Si based supercapacitor electrodes are demonstrated. High power density and stability is provided by ultra-thin TiN coating of the porous Si matrix. The TiN layer is deposited by atomic layer deposition (ALD), which provides sufficient conformality to reach the bottom of the high aspect ratio pores. Our porous Si supercapacitor devices exhibit almost ideal double layer capacitor characteristic with electrode volumetric capacitance of 7.3 F/cm3. Several orders of magnitude increase in power and energy density is obtained comparing to uncoated porous silicon electrodes. Good stability of devices is confirmed performing several thousands of charge/discharge cycles.
Original language | English |
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Article number | 012058 |
Number of pages | 4 |
Journal | Journal of Physics: Conference Series |
Volume | 557 |
Issue number | Conference 1 |
DOIs | |
Publication status | Published - 2014 |
MoE publication type | A1 Journal article-refereed |
Event | 14th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications, PowerMEMS 2014 - Hyogo, Japan Duration: 18 Nov 2014 → 21 Nov 2014 |
Keywords
- porous silicon
- ALD
- supercapacitor
- in-chip device