Comparative study on radio frequency and reliability performance of electronically conductive adhesives

Elmeri Österlund; Vesa Vuorinen; Juha Jokilahti; Timo Galkin; Olli Salmela; Mervi Paulasto-Kröckel

doi:10.1109/ESTC.2016.7764732

Comparative study on radio frequency and reliability performance of electronically conductive adhesives

Elmeri Österlund
, Vesa Vuorinen
, Juha Jokilahti
, Timo Galkin
, Olli Salmela
, Mervi Paulasto-Kröckel

Not published at VTT

Aalto University
Nokia Bell Labs, Finland

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

Abstract

ECAs are nowadays used as a lead-free replacement for solders. They are used in microelectronics for packaging, bonding of surface mount devices, in flip chip and in ball grid arrays and in LCD screens. Benefits of ECAs over solders include lower temperature and simpler processing, environmental friendliness, finer pitch and lower thermomechanical stresses. However, ECAs have higher overall electrical resistance and they are not as reliable.

Original language	English
Title of host publication	2016 6th Electronic System-Integration Technology Conference (ESTC)
Publisher	IEEE Institute of Electrical and Electronic Engineers
ISBN (Electronic)	978-1-5090-1403-3
ISBN (Print)	978-1-5090-1402-6
DOIs	https://doi.org/10.1109/ESTC.2016.7764732
Publication status	Published - 2016
MoE publication type	B3 Non-refereed article in conference proceedings
Event	6th Electronic System-Integration Technology Conference, ESTC 2016 - Grenoble, France Duration: 13 Sept 2016 → 16 Sept 2016 Conference number: 6

Conference

Conference	6th Electronic System-Integration Technology Conference, ESTC 2016
Abbreviated title	ESTC 2016
Country/Territory	France
City	Grenoble
Period	13/09/16 → 16/09/16

Access to Document

10.1109/ESTC.2016.7764732

Cite this

Österlund, E., Vuorinen, V., Jokilahti, J., Galkin, T., Salmela, O., & Paulasto-Kröckel, M. (2016). Comparative study on radio frequency and reliability performance of electronically conductive adhesives. In 2016 6th Electronic System-Integration Technology Conference (ESTC) IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/ESTC.2016.7764732

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title = "Comparative study on radio frequency and reliability performance of electronically conductive adhesives",

abstract = "ECAs are nowadays used as a lead-free replacement for solders. They are used in microelectronics for packaging, bonding of surface mount devices, in flip chip and in ball grid arrays and in LCD screens. Benefits of ECAs over solders include lower temperature and simpler processing, environmental friendliness, finer pitch and lower thermomechanical stresses. However, ECAs have higher overall electrical resistance and they are not as reliable.",

author = "Elmeri {\"O}sterlund and Vesa Vuorinen and Juha Jokilahti and Timo Galkin and Olli Salmela and Mervi Paulasto-Kr{\"o}ckel",

year = "2016",

doi = "10.1109/ESTC.2016.7764732",

language = "English",

isbn = "978-1-5090-1402-6",

booktitle = "2016 6th Electronic System-Integration Technology Conference (ESTC)",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

note = "6th Electronic System-Integration Technology Conference, ESTC 2016, ESTC 2016 ; Conference date: 13-09-2016 Through 16-09-2016",

}

Österlund, E, Vuorinen, V, Jokilahti, J, Galkin, T, Salmela, O & Paulasto-Kröckel, M 2016, Comparative study on radio frequency and reliability performance of electronically conductive adhesives. in 2016 6th Electronic System-Integration Technology Conference (ESTC). IEEE Institute of Electrical and Electronic Engineers, 6th Electronic System-Integration Technology Conference, ESTC 2016, Grenoble, France, 13/09/16. https://doi.org/10.1109/ESTC.2016.7764732

Comparative study on radio frequency and reliability performance of electronically conductive adhesives. / Österlund, Elmeri; Vuorinen, Vesa; Jokilahti, Juha et al.
2016 6th Electronic System-Integration Technology Conference (ESTC). IEEE Institute of Electrical and Electronic Engineers, 2016.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

TY - GEN

T1 - Comparative study on radio frequency and reliability performance of electronically conductive adhesives

AU - Österlund, Elmeri

AU - Vuorinen, Vesa

AU - Jokilahti, Juha

AU - Galkin, Timo

AU - Salmela, Olli

AU - Paulasto-Kröckel, Mervi

N1 - Conference code: 6

PY - 2016

Y1 - 2016

N2 - ECAs are nowadays used as a lead-free replacement for solders. They are used in microelectronics for packaging, bonding of surface mount devices, in flip chip and in ball grid arrays and in LCD screens. Benefits of ECAs over solders include lower temperature and simpler processing, environmental friendliness, finer pitch and lower thermomechanical stresses. However, ECAs have higher overall electrical resistance and they are not as reliable.

AB - ECAs are nowadays used as a lead-free replacement for solders. They are used in microelectronics for packaging, bonding of surface mount devices, in flip chip and in ball grid arrays and in LCD screens. Benefits of ECAs over solders include lower temperature and simpler processing, environmental friendliness, finer pitch and lower thermomechanical stresses. However, ECAs have higher overall electrical resistance and they are not as reliable.

U2 - 10.1109/ESTC.2016.7764732

DO - 10.1109/ESTC.2016.7764732

M3 - Conference article in proceedings

SN - 978-1-5090-1402-6

BT - 2016 6th Electronic System-Integration Technology Conference (ESTC)

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - 6th Electronic System-Integration Technology Conference, ESTC 2016

Y2 - 13 September 2016 through 16 September 2016

ER -

Comparative study on radio frequency and reliability performance of electronically conductive adhesives

Abstract

Conference

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