Comparison of analytical methods for residue detection of resist removal processes

Tarja Riihisaari, Jari Likonen, Ari Kiviranta, S. Eränen, S. Lehto, Jarkko Tuominen, Timo Lindblom, Esa Muukkonen

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    2 Citations (Scopus)

    Abstract

    In integrated circuits fabrication photoresist layers are used as a pattern definition in etching and as a mask in ion implantation. Since photoresist layers are only used as an intermediate step and are not incorporated in the final structure, photoresist layers need to be thoroughly removed from the wafer surface. In this work we have evaluated the use of different on-line and off-line analytical methods for the detection of process residues of photoresist removal.

    Original languageEnglish
    Title of host publicationUltra Clean Processing of Silicon Surfaces IV
    EditorsMarc Heyns, Marc Meuris, Paul Mertens
    PublisherTrans Tech Publications
    Pages215-218
    ISBN (Electronic)978-3-0357-0683-3, 978-3-03859-999-9
    ISBN (Print)978-3-908450-40-5
    DOIs
    Publication statusPublished - 1998
    MoE publication typeA4 Article in a conference publication
    Event4th International Symposium on Ultra Clean Processing of Silicon Surfaces, UCPSS 1998 - Ostend, Belgium
    Duration: 21 Sep 199823 Sep 1998

    Publication series

    SeriesSolid State Phenomena
    Volume65-66
    ISSN1012-0394

    Conference

    Conference4th International Symposium on Ultra Clean Processing of Silicon Surfaces, UCPSS 1998
    Country/TerritoryBelgium
    CityOstend
    Period21/09/9823/09/98

    Keywords

    • AFM
    • P and T-GC/MS
    • SIMS

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